Environmental Conditions The ADSP-BF535 is offered in a 260-ball PBGA package. To determine the junction temperature on " />
參數(shù)資料
型號(hào): ADSP-BF535PBB-300
廠商: Analog Devices Inc
文件頁數(shù): 32/44頁
文件大?。?/td> 0K
描述: IC DSP CONTROLLER 16BIT 260BGA
產(chǎn)品培訓(xùn)模塊: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點(diǎn)
接口: PCI,SPI,SSP,UART,USB
時(shí)鐘速率: 300MHz
非易失內(nèi)存: 外部
芯片上RAM: 308kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.50V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 260-BBGA
供應(yīng)商設(shè)備封裝: 260-PBGA(19x19)
包裝: 托盤
ADSP-BF535
–38–
REV. A
Environmental Conditions
The ADSP-BF535 is offered in a 260-ball PBGA package.
To determine the junction temperature on the application printed
circuit board use:
where:
TJ = Junction temperature ( C)
TCASE = Case temperature ( C) measured by customer at top
center of package.
ΨJ
T = From Table 28
PD = Power dissipation (see Power Dissipation on Page 36 for the
method to calculate PD)
Values of
θJ
A are provided for package comparison and printed
circuit board design considerations.
θJ
A can be used for a first
order approximation of TJ by the equation:
where:
TA = Ambient temperature ( C)
Values of
θJ
C are provided for package comparison and printed
circuit board design considerations when an external heatsink is
required.
Values of
θJ
B are provided for package comparison and printed
circuit board design considerations.
In Table 28, airflow measurements comply with JEDEC
standards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
TJ
TCASE
Ψ
JT
PD
×
()
+
=
TJ
TA
θ
JA
PD
×
()
+
=
Table 28. Thermal Characteristics
Parameter
Condition
Typical
Unit
θJ
A
0 linear m/s air flow
23.8
C/W
θJ
MA
1 linear m/s air flow
20.8
C/W
θJ
MA
2 linear m/s air flow
19.8
C/W
θJ
B
9.95
C/W
θJ
C
9.35
C/W
ΨJ
T
0 linear m/s air flow
0.30
C/W
相關(guān)PDF資料
PDF描述
GBM08DRMH CONN EDGECARD 16POS .156 WW
VI-B1R-CV-F4 CONVERTER MOD DC/DC 7.5V 150W
GBM08DRMD CONN EDGECARD 16POS .156 WW
VJ1206A680JBCAT4X CAP CER 68PF 200V 5% NP0 1206
VI-B1R-CV-F3 CONVERTER MOD DC/DC 7.5V 150W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-BF535PBBZ-200 功能描述:IC DSP CONTROLLER 16BIT 260-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSPBF535PKB300 制造商:Analog Devices 功能描述:
ADSP-BF535PKB-300 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-BF535PKB-350 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-BF535PKB-C91 制造商:Analog Devices 功能描述: