參數(shù)資料
型號(hào): ADSP-21060LKB-160
廠商: ANALOG DEVICES INC
元件分類: 數(shù)字信號(hào)處理
英文描述: RES, 2.2 K SM CHIP 5% 50V 1/16 WATT, 0603
中文描述: 48-BIT, 40 MHz, OTHER DSP, PBGA225
封裝: PLASTIC, MS-034AAJ-2, BGA-225
文件頁數(shù): 27/47頁
文件大?。?/td> 366K
代理商: ADSP-21060LKB-160
ADSP-21060/ADSP-21060L
–27–
REV. D
ADSP-21060
Min
ADSP-21060L
Parameter
Max
Min
Max
Units
Read Cycle
Timing Requirements:
t
SADRDL
t
HADRDH
t
WRWH
t
DRDHRDY
t
DRDHRDY
Address Setup/
CS
Low before
RD
Low
1
Address Hold/
CS
Hold Low after
RD
RD
/
WR
High Width
RD
High Delay after REDY (O/D) Disable
RD
High Delay after REDY (A/D) Disable
0
0
6
0
0
0
0
6
0
0
ns
ns
ns
ns
ns
Switching Characteristics:
t
SDATRDY
t
DRDYRDL
t
RDYPRD
Data Valid before REDY Disable from Low
REDY (O/D) or (A/D) Low Delay after
RD
Low
REDY (O/D) or (A/D) Low Pulsewidth
for Read
Data Disable after
RD
High
2
2
ns
ns
10
10.5
45 + 21DT/16
2
45 + 21DT/16
2
ns
ns
t
HDARWH
8
8.5
Write Cycle
Timing Requirements:
t
SCSWRL
t
HCSWRH
t
SADWRH
t
HADWRH
t
WWRL
t
WRWH
t
DWRHRDY
CS
Low Setup before
WR
Low
CS
Low Hold after
WR
High
Address Setup before
WR
High
Address Hold after
WR
High
WR
Low Width
RD
/
WR
High Width
WR
High Delay after REDY
(O/D) or (A/D) Disable
Data Setup before
WR
High
Data Hold after
WR
High
0
0
5
2
7
6
0
0
5
2
7
6
ns
ns
ns
ns
ns
ns
0
5
1
0
5
1
ns
ns
ns
t
SDATWH
t
HDATWH
Switching Characteristics:
t
DRDYWRL
REDY (O/D) or (A/D) Low Delay
after
WR
/
CS
Low
REDY (O/D) or (A/D) Low Pulsewidth
for Write
REDY (O/D) or (A/D) Disable to CLKIN
10
10.5
ns
t
RDYPWR
15 + 7DT/16
1 + 7DT/16
15 + 7DT/16
1 + 7DT/16
ns
ns
t
SRDYCK
8 + 7DT/16
8 + 7DT/16
NOTE
1
Not required if
RD
and address are valid t
HBGRCSV
after
HBG
goes low. For first access after
HBR
asserted, ADDR
31-0
must be a non-MMS value 1/2 t
CLK
before
RD
or
WR
goes low or by t
HBGRCSV
after HBG goes low. This is easily accomplished by driving an upper address signal high when
HBG
is asserted. See the “Host Proces-
sor Control of the ADSP-2106x” section in the
ADSP-2106x SHARC User’s Manual, Second Edition.
CLKIN
REDY (O/D)
O/D = OPEN DRAIN, A/D = ACTIVE DRIVE
t
SRDYCK
REDY (A/D)
Figure 18a. Synchronous REDY Timing
Asynchronous Read/Write—Host to ADSP-2106x
Use these specifications for asynchronous host processor accesses
of an ADSP-2106x, after the host has asserted
CS
and
HBR
(low). After
HBG
is returned by the ADSP-2106x, the host can
drive the
RD
and
WR
pins to access the ADSP-2106x’s internal
memory or IOP registers.
HBR
and
HBG
are assumed low for
this timing.
相關(guān)PDF資料
PDF描述
ADSP-21060LKS-133 ADSP-2106x SHARC DSP Microcomputer Family
ADSP-21060LKS-160 ADSP-2106x SHARC DSP Microcomputer Family
ADSP-21061KS-133 ADSP-2106x SHARC DSP Microcomputer Family
ADSP-21061 ADSP-2106x SHARC DSP Microcomputer Family
ADSP-21061L ADSP-2106x SHARC DSP Microcomputer Family
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-21060LKBZ-160 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述:
ADSP-21060LKS-133 制造商:Analog Devices 功能描述:DSP Floating-Point 32-Bit 33MHz 33MIPS 240-Pin MQFP 制造商:Rochester Electronics LLC 功能描述:FLOATING PT PROCESSOR, 3.3V, 33MHZ. - Bulk
ADSP-21060LKS-160 功能描述:IC DSP CONTROLLER 32BIT 240MQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21060LKSZ-133 功能描述:IC DSP CONTROLLER 32BIT 240-MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-21060LKSZ-160 功能描述:IC DSP CONTROLLER 32BIT 240MQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:SHARC® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤