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參數(shù)資料
| 型號： | ADF4001BRU |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | XO, clock |
| 英文描述： | 200 MHz Clock Generator PLL |
| 中文描述： | 200 MHz, OTHER CLOCK GENERATOR, PDSO16 |
| 封裝： | TSSOP-16 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大?。?/td> | 190K |
| 代理商： | ADF4001BRU |
REV. 0
ADF4001
–3–
(AV
DD
= DV
DD
= 3 V 10%, 5 V 10%; AV
DD
≤
V
P
≤
6.0 V
; AGND = DGND = CPGND= 0 V; R
SET
=
; T
A
= T
MIN
to T
MAX
unless otherwise noted; dBm referred to 50 .)
4.7 k
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
t
1
t
2
t
3
t
4
t
6
t
5
DB20
(MSB)
DB19
DB2
DB1
(CONTROL BIT C2)
CLOCK
DATA
LE
LE
DB0 (LSB)
(CONTROL BIT C1)
Figure 1. Timing Diagram
TIMING CHARACTERISTICS
Limit at
T
MIN
to T
MAX
(B Version)
Parameter
Unit
Test Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
DATA to CLOCK Set Up Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Set Up Time
LE Pulsewidth
NOTES
Guaranteed by design but not production tested.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1, 2
(
T
A
= 25
°
C unless otherwise noted)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . 0 V to + 0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . . . –0.3 V to V
DD
+ 0.3 V
RF
INA
to RF
INB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
320 mV
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . .150
°
C
TSSOP
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 150.4
°
C/W
CSP
θ
JA
Thermal Impedance (Paddle Soldered) . . . . 122
°
C/W
CSP
θ
JA
Thermal Impedance (Paddle Not Soldered) . . 216
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 k
and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
ADF4001BRU
ADF4001BCP
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
*
RU-16
CP-20
*
Contact factory for chip availability.
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