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參數(shù)資料
| 型號(hào)： | ADCLK854/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 13/16頁(yè) |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION FOR ADCLK845 |
| 設(shè)計(jì)資源： | Clock Distribution Circuit with Pin-Programmable Output Frequency, Output Logic Levels, and Fanout (CN0152) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，時(shí)鐘緩沖器 / 驅(qū)動(dòng)器 / 接收器 / 變換器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADCLK854 |
| 主要屬性： | 2 輸入，12 輸出 |
| 次要屬性： | CMOS，LVDS 輸出 |
| 已供物品： | 板 |
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ADCLK854
Rev. 0 | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
VS to GND
2 V
Inputs
CLKx and CLKx
0.3 V to +2 V
CMOS Inputs
0.3 V to +2 V
Outputs
Maximum Voltage
0.3 V to +2 V
Voltage Reference Voltage (VREF)
0.3 to +2 V
Operating Temperature
Ambient Range
40°C to +85°C
Junction
150°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
TJ
= TCASE + (ΨJT × PD)
where:
TJ
is the junction temperature (°C).
TCASE
is the case temperature (°C) measured by the user at the
top center of the package.
Ψ
JT
is from Table 6.
PD
is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order approxi-
mation of TJ by the equation
TJ
= TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided in Table 6 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter
Symbol
Description (Using a 2S2P Test Board)
Value 1
Unit
Junction-to-Ambient Thermal Resistance
θ
JA
Still Air
Per JEDEC JESD51-2
0.0 m/sec Air Flow
42
°C/W
Moving Air
θ
JMA
Per JEDEC JESD51-6
1.0 m/sec Air Flow
37
°C/W
2.5 m/sec Air Flow
33
°C/W
Junction-to-Board Thermal Resistance
θ
JB
Moving Air
Per JEDEC JESD51-8
1.0 m/sec Air Flow
26
°C/W
Junction-to-Case Thermal Resistance
θ
JC
Moving Air
Per MIL-STD 883, Method 1012.1
Die-to-Heat Sink
2
°C/W
Junction-to-Top-of-Package Characterization Parameter
Ψ
JT
Still Air
Per JEDEC JESD51-2
0 m/sec Air Flow
0.5
°C/W
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADCLK905 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Ultrafast SiGe ECL Clock/Data Buffers |
| ADCLK905/PCBZ | 功能描述:BOARD EVAL FOR ADCLK905 16LFCSP RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評(píng)估演示板和套件 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 主要目的:電信，線路接口單元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要屬性:T1/J1/E1 LIU 次要屬性:- 已供物品:板，電源，線纜，CD 其它名稱:82EBV2081 |
| ADCLK905BCPZ-R2 | 功能描述:IC CLK/DATA BUFF DVR 1:1 16LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:SIGe 標(biāo)準(zhǔn)包裝:74 系列:- 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:32-QFN（5x5） 包裝:管件 |
| ADCLK905BCPZ-R7 | 功能描述:IC CLK/DATA BUFF DVR 1:1 16LFCSP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:SIGe 產(chǎn)品培訓(xùn)模塊:High Bandwidth Product Overview 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:4 差分 - 輸入:輸出:是/是 輸入:CML，LVDS，LVPECL 輸出:CML 頻率 - 最大:2.5GHz 電源電壓:2.375 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤，16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?（3x3） 包裝:帶卷 (TR) |
| ADCLK905BCPZ-TR | 制造商:Analog Devices 功能描述:1:1 ECL,,7 GBPPS CLOCK/DATA BUFFERS - Tape and Reel |
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