- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄2063 > ADA4941-1YRZ-R7 (Analog Devices Inc)IC DIFF ADC DRIVER 18BIT 8SOIC PDF資料下載
參數(shù)資料
| 型號(hào)： | ADA4941-1YRZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 23/25頁(yè) |
| 文件大小： | 0K |
| 描述： | IC DIFF ADC DRIVER 18BIT 8SOIC |
| 設(shè)計(jì)資源： | Converting a Single-Ended Signal with AD7982 Differential PulSAR ADC (CN0032) Converting a Single-Ended Signal with AD7984 Differential PulSAR ADC (CN0033) |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類(lèi)型： | ADC 驅(qū)動(dòng)器 |
| 應(yīng)用： | 數(shù)據(jù)采集 |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 帶卷 (TR) |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)當(dāng)前第23頁(yè)第24頁(yè)第25頁(yè)
ADA4941-1
Rev. C | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
12 V
Power Dissipation
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in the circuit board with its
exposed paddle soldered to a pad (if applicable) on the PCB
surface that is thermally connected to a copper plane, with zero
airflow.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
8-Lead SOIC on 4-Layer Board
126
28
°C/W
8-Lead LFCSP with EP on 4-Layer Board
83
19
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4941-1
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4941-1. Exceeding a
junction temperature of 150°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The power dissipated due to the load
drive depends upon the particular application. For each output,
the power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to all of the loads is equal to the sum of
the power dissipation due to each individual load. RMS voltages
and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA. The exposed paddle on the underside of the
package must be soldered to a pad on the PCB surface that is
thermally connected to a copper plane to achieve the specified θJA.
Figure 3 shows the maximum safe power dissipation in the
packages vs. the ambient temperature for the 8-lead SOIC
(126°C/W) and for the 8-lead LFCSP (83°C/W) on a JEDEC
standard 4-layer board. The LFCSP must have its underside
paddle soldered to a pad that is thermally connected to a PCB
plane. θJA values are approximations.
2.5
0
–40
120
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
2.0
1.5
1.0
0.5
–20
0
20
40
60
80
100
LFCSP
SOIC
05704-
002
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADA4960-1ACPZ-R2 | IC ADC DRIVER DIFF 16LFCSP |
| ADATE205BSVZ | IC DCL DUAL 250MHZ ATE 100TQFP |
| ADATE206BSVZ | IC DCL DUAL 500MHZ ATE 100TQFP |
| ADAU1401AWBSTZ-RL | IC AUDIO PROC 28/56BIT 48LQFP |
| ADAU1401YSTZ-RL | IC AUDIO PROC 28/56BIT 48LQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADA4941-1YRZ-RL | 功能描述:IC DIFF ADC DRIVER 18BIT 8SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 放大器 - 專(zhuān)用 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類(lèi)型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類(lèi)型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤(pán) |
| ADA4950-1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3 |
| ADA4950-1YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4950-1YCP RoHS:是 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 評(píng)估板 - 運(yùn)算放大器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| ADA4950-1YCPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single ±5.5V/11V 16-Pin LFCSP EP T/R 制造商:Analog Devices 功能描述:FIXED GAIN 1,2&3 DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single }5.5V/11V 16-Pin LFCSP EP |
| ADA4950-1YCPZ-R7 | 功能描述:IC AMP DIFF LP 114MA 16LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類(lèi)型:RF/IF 差分 電路數(shù):1 輸出類(lèi)型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤(pán)，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁(yè)面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。