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參數(shù)資料
| 型號： | AD9211-200EBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 27/28頁 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD9211-200 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| ADC 的數(shù)量： | 1 |
| 位數(shù)： | 10 |
| 采樣率（每秒）： | 200M |
| 數(shù)據(jù)接口： | 串行 |
| 輸入范圍： | 0.98 ~ 1.5 V |
| 在以下條件下的電源（標(biāo)準(zhǔn)）： | 437mW @ 1.8V |
| 工作溫度： | -40°C ~ 85°C |
| 已用 IC / 零件： | AD9211 |
| 已供物品： | 板，電源 |
| 相關(guān)產(chǎn)品： | AD9211BCPZ-300-ND - IC ADC 10BIT 300MSPS 56LFCSP AD9211BCPZ-250-ND - IC ADC 10-BIT 250MSPS 56-LFCSP AD9211BCPZ-200-ND - IC ADC 10-BIT 200MSPS 56-LFCSP |
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AD9211
Rev. 0 | Page 8 of 28
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
ELECTRICAL
AVDD to AGND
0.3 V to +2.0 V
DRVDD to DRGND
0.3 V to +2.0 V
AGND to DRGND
0.3 V to +0.3 V
AVDD to DRVDD
2.0 V to +2.0 V
D0+/D0 through D9+/D9
to DRGND
0.3 V to DRVDD + 0.3 V
DCO to DRGND
0.3 V to DRVDD + 0.3 V
OR to DGND
0.3 V to DRVDD + 0.3 V
CLK+ to AGND
0.3 V to +3.9 V
CLK to AGND
0.3 V to +3.9 V
VIN+ to AGND
0.3 V to AVDD + 0.2 V
VIN to AGND
0.3 V to AVDD + 0.2 V
SDIO/DCS to DGND
0.3 V to DRVDD + 0.3 V
PWDN to AGND
0.3 V to +3.9 V
CSB to AGND
0.3 V to +3.9 V
SCLK/DFS to AGND
0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane
for the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
θJA
θJC
Unit
56-Lead LFCSP (CP-56-2)
30.4
2.9
°C/W
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θJA.
ESD CAUTION
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD9211-250EB | 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
| AD9211-250EBZ | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 10-Bit 250 Msps ADC RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| AD9211-300EBZ | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 10-Bit 300 Msps ADC RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| AD9211BCPZ-170 | 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter |
| AD9211BCPZ-200 | 功能描述:IC ADC 10-BIT 200MSPS 56-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應(yīng)商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個單端，雙極 |
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