參數(shù)資料
型號: AD8332ACP-R2
廠商: Analog Devices Inc
文件頁數(shù): 51/56頁
文件大?。?/td> 0K
描述: IC VGA DUAL W/PREAMP LN 32-LFCSP
產(chǎn)品變化通告: Product Discontinuance 27/July/2010
標準包裝: 1
系列: X-AMP®
類型: 可變增益放大器
應(yīng)用: 信號處理
安裝類型: 表面貼裝
封裝/外殼: 32-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 32-LFCSP-VQ(5x5)
包裝: 標準包裝
配用: AD8332-EVALZ-ND - BOARD EVAL FOR AD8332
其它名稱: AD8332ACP-R2DKR
AD8331/AD8332/AD8334
Rev. G | Page 55 of 56
ORDERING GUIDE
Model1
Temperature Range
Package Description
Package Option
AD8331ARQ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQ-REEL7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-RL
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331ARQZ-R7
–40°C to +85°C
20-Lead Shrink Small Outline Package (QSOP)
RQ-20
AD8331-EVALZ
Evaluation Board with AD8331ARQ
AD8332ACP-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACP-REEL7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-R7
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ACPZ-RL
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD8332ARU
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARU-REEL7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-R7
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332ARUZ-RL
–40°C to +85°C
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
AD8332-EVALZ
Evaluation Board with AD8332ARU
AD8334ACPZ
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334ACPZ-REEL7
–40°C to +85°C
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-64-1
AD8334-EVALZ
Evaluation Board with AD8334ACP
1 Z = RoHS Compliant Part.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD8332ACP-REEL 制造商:Analog Devices 功能描述:SP Amp Variable Gain Amp Dual 5.5V 32-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:
AD8332ACP-REEL7 制造商:Analog Devices 功能描述:SP Amp Variable Gain Amp Dual 5.5V 32-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:
AD8332ACPZ-R2 功能描述:IC AMP VGA PREAMP PROGR 32-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8332ACPZ-R7 功能描述:IC AMP VAR GAIN 2CHAN 32-LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤
AD8332ACPZ-RL 功能描述:IC AMP VAR GAIN 2CHAN 32LFCSP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:X-AMP® 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應(yīng)用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:20-TQFN-EP(5x5) 包裝:托盤