Changed RFB to R
參數(shù)資料
型號(hào)： AD8332ACP-R2
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 23/56頁(yè)
文件大?。?/td> 0K
描述： IC VGA DUAL W/PREAMP LN 32-LFCSP
產(chǎn)品變化通告： Product Discontinuance 27/July/2010
標(biāo)準(zhǔn)包裝： 1
系列： X-AMP®
類(lèi)型： 可變?cè)鲆娣糯笃?br>
應(yīng)用： 信號(hào)處理
安裝類(lèi)型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤(pán)，CSP
供應(yīng)商設(shè)備封裝： 32-LFCSP-VQ（5x5）
包裝： 標(biāo)準(zhǔn)包裝
配用： AD8332-EVALZ-ND - BOARD EVAL FOR AD8332
其它名稱(chēng)： AD8332ACP-R2DKR
AD8331/AD8332/AD8334
Rev. G | Page 3 of 56
4/08—Rev. E to Rev. F
Changed RFB to RIZ Throughout .....................................................4
Changes to Figure 1...........................................................................1
Changes to Table 1, LNA and VGA Characteristics, Output
Offset Voltage, Conditions ...............................................................4
Changes to Quiescent Current per Channel and Power Down
Current Parameters...........................................................................6
Changes to Table 2 ............................................................................7
Changes to Table 3, Pin 1 Description ...........................................8
Changes to Table 4, Pin 1 and Pin 28 Descriptions ......................9
Changes to Table 5, Pin 4 and Pin 5 Descriptions ........................9
Changes to Table 6, Pin 2, Pin 15, and Pin 20 Descriptions......10
Changes to Table 6, Pin 61 Description .......................................11
Changes to Typical Performance Characteristics Section,
Default Conditions..........................................................................12
Changes to Figure 25 ......................................................................15
Changes to Figure 39 ......................................................................17
Changes to Figure 55 Through Figure 68 ...................................20
Changes to Theory of Operation, Overview Section .................24
Changes to Low Noise Amplifier Section and Figure 74 ...........25
Changes to Active Impedance Matching Section, Figure 75,
and Figure 77 ...................................................................................26
Changes to Figure 78 ......................................................................27
Changes to Equation 6, Table 7, Figure 81, and Figure 82.........30
Changes to Figure 83 ......................................................................31
Changes to Figure 88 ......................................................................32
Switched Figure 89 and Figure 90 .................................................33
Changes to Figure 89 ......................................................................33
Changes to Ultrasound TGC Application Section......................34
Incorporated AD8331-EVAL Data Sheet, Rev. A .......................39
Changes to User-Supplied Optional Components Section
and Measurement Setup Section...................................................39
Changes to Figure 95 ......................................................................39
Changes to Figure 97 ......................................................................41
Added Figure 98 ..............................................................................42
Incorporated AD8332-EVALZ Data Sheet, Rev. D.....................44
Incorporated AD8334-EVAL Data Sheet, Rev. 0 ........................49
Updated Outline Dimensions........................................................55
Changes to Ordering Guide...........................................................57
4/06—Rev. D to Rev. E
Added AD8334 ................................................................... Universal
Changes to Figure 1 and Figure 2....................................................1
Changes to Table 1 ............................................................................4
Changes to Table 2 ............................................................................7
Changes to Figure 7 through Figure 9 and Figure 12.................12
Changes to Figure 13, Figure 14, Figure 16, and Figure 18 .......13
Changes to Figure 23 and Figure 24 .............................................14
Changes to Figure 25 through Figure 27......................................15
Changes to Figure 31 and Figure 33 through Figure 36 ............16
Changes to Figure 37 through Figure 42......................................17
Changes to Figure 43, Figure 44, and Figure 48..........................18
Changes to Figure 49, Figure 50, and Figure 54..........................19
Inserted Figure 56 and Figure 57 ..................................................20
Inserted Figure 58, Figure 59, and Figure 61...............................21
Changes to Figure 60 ......................................................................21
Inserted Figure 63 and Figure 65 ..................................................22
Changes to Figure 64 ......................................................................22
Moved Measurement Considerations Section ............................23
Inserted Figure 67 and Figure 68 ..................................................23
Inserted Figure 70 and Figure 71 ..................................................24
Change to Figure 72........................................................................24
Changes to Figure 73 and Low Noise Amplifier Section...........25
Changes to Postamplifier Section .................................................28
Changes to Figure 80 ......................................................................29
Changes to LNA—External Components Section......................30
Changes to Logic Inputs—ENB, MODE, and HILO Section ...31
Changes to Output Decoupling and Overload Sections............32
Changes to Layout, Grounding, and Bypassing Section............33
Changes to Ultrasound TGC Application Section .....................34
Added High Density Quad Layout Section .................................34
Inserted Figure 94 ...........................................................................38
Updated Outline Dimensions........................................................39
Changes to Ordering Guide...........................................................40
3/06—Rev. C to Rev. D
Updated Format ................................................................. Universal
Changes to Features and General Description..............................1
Changes to Table 1 ............................................................................3
Changes to Table 2 ............................................................................6
Changes to Ordering Guide...........................................................34
11/03—Rev. B to Rev. C
Addition of New Part......................................................... Universal
Changes to Figures............................................................. Universal
Updated Outline Dimensions........................................................32
5/03—Rev. A to Rev. B
Edits to Ordering Guide.................................................................32
Edits to Ultrasound TGC Application Section ...........................25
Added Figure 71, Figure 72, and Figure 73..................................26
Updated Outline Dimensions........................................................31
2/03—Rev. 0 to Rev. A
Edits to Ordering Guide.................................................................32
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AD8332ACPZ-R7 功能描述:IC AMP VAR GAIN 2CHAN 32-LFCSP RoHS:是 類(lèi)別:集成電路 (IC) >> 線性 - 放大器 - 專(zhuān)用 系列:X-AMP® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:60 系列:- 類(lèi)型:可變?cè)鲆娣糯笃?應(yīng)用:CATV 安裝類(lèi)型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:20-TQFN-EP（5x5） 包裝:托盤(pán)
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