參數(shù)資料
型號: AD823AARZ-RL
廠商: Analog Devices Inc
文件頁數(shù): 17/20頁
文件大?。?/td> 0K
描述: IC OPAMP FET RR 17MHZ DUAL 8SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: J-FET
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 35 V/µs
-3db帶寬: 19MHz
電流 - 輸入偏壓: 1.3pA
電壓 - 輸入偏移: 700µV
電流 - 電源: 6.3mA
電流 - 輸出 / 通道: 44mA
電壓 - 電源,單路/雙路(±): 3 V ~ 36 V,±1.5 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
AD823A
Data Sheet
Rev. B | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
36 V
Power Dissipation
Input Voltage (Common Mode)
±VS ± 0.7 V
Differential Input Voltage
±VS
Output Short-Circuit Duration
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
ESD Ratings (Human Body Model)
4500 V
ESD Ratings (Charged Device Model)
1250 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Use the part with caution at the 30 V supply as excessive output
current may overheat and damage the part.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
The specification is for the device in free air.
Table 5. Thermal Resistance
Package Type
θJA
Unit
8-Lead SOIC_N
120
°C/W
8-Lead MSOP
133
°C/W
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
AMBIENT TEMPERATURE (°C)
2.0
1.5
0
–45 –35 –25 –15
–5
5
15
25
35
45
55
65
75
85
1.0
0.5
TJ = 150°C
09
43
9
-00
4
8-LEAD MSOP
8-LEAD SOIC
Figure 4. Maximum Power Dissipation vs. Temperature
ESD CAUTION
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