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參數(shù)資料
| 型號： | AD8231WACPZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 22/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP INST RRO 2.7MHZ 16LFCSP |
| 標準包裝： | 5,000 |
| 放大器類型： | 儀表 |
| 電路數(shù)： | 2 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 1.1 V/µs |
| 增益帶寬積： | 7MHz |
| 電流 - 輸入偏壓： | 250pA |
| 電壓 - 輸入偏移： | 4µV |
| 電流 - 電源： | 4mA |
| 電流 - 輸出 / 通道： | 70mA |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 6 V，±1.5 V ~ 3 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 16-LFCSP-VQ EP（4x4） |
| 包裝： | 帶卷 (TR) |
AD8231
Rev. B | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
Rating
Supply Voltage
6 V
Output Short-Circuit Current
Indefinite1
Input Voltage (Common-Mode)
VS 0.3 V to +VS + 0.3 V
Differential Input Voltage
VS 0.3 V to +VS + 0.3 V
Storage Temperature Range
–65°C to +150°C
Operational Temperature Range
–40°C to +125°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
1.5 kV
ESD (Charged Device Model)
1.5 kV
ESD (Machine Model)
0.2 kV
Table 5.
Thermal Pad
θJA
Unit
Soldered to Board
54
°C/W
Not Soldered to Board
96
°C/W
board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad
is 6.3°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8231 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric perform-
ance of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
1 For junction temperatures between 105°C and 130°C, short-circuit operation
beyond 1000 hours can impact part reliability.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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