參數(shù)資料
型號: AD8195ACPZ
廠商: Analog Devices Inc
文件頁數(shù): 16/20頁
文件大?。?/td> 0K
描述: IC BUFF HDMI/DVI W/EQUAL 40LFCSP
標(biāo)準(zhǔn)包裝: 1
功能: 開關(guān)
電路: 1 x 1:1
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 40-VFQFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 40-LFCSP-VQ(6x6)
包裝: 托盤
Data Sheet
AD8195
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
AVCC to AVEE
3.7 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
AMUXVCC
5.5 V
VREF_IN
5.5 V
VREF_OUT
5.5 V
Internal Power Dissipation
1.81 W
High Speed Input Voltage
AVCC 1.4 V < VIN <
AVCC + 0.6 V
High Speed Differential Input Voltage
2.0 V
Parallel Control Input Voltage
AVEE 0.3 V < VIN <
AVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
ESD, Human Body Model
Input Pins Only
±5 kV
All Other Pins
±3 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 5.
Package
θJA
θJC
Unit
40-Lead LFCSP_VQ
36
5.0
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8195
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in device
failure. To ensure proper operation, it is necessary to observe
the maximum power derating as determined by the thermal
resistance coefficients.
ESD CAUTION
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