參數(shù)資料
型號(hào): AD8159ASVZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 14/24頁(yè)
文件大小: 0K
描述: IC MUX/DEMUX QUAD BUFF 100TQFP
標(biāo)準(zhǔn)包裝: 1
系列: XStream™
應(yīng)用: 2:1 多路復(fù)用器/1:2 多路分配器
接口: 串行
電源電壓: 3 V ~ 3.6 V
封裝/外殼: 100-TQFP 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 100-TQFP-EP(14x14)
包裝: 管件
安裝類(lèi)型: 表面貼裝
產(chǎn)品目錄頁(yè)面: 801 (CN2011-ZH PDF)
AD8159
Rev. B | Page 21 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
1
25
26
50
76
100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.75
0.60
0.45
1.20
MAX
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
0° MIN
3.5°
0.15
0.05
VIEW A
PIN 1
TOP VIEW
(PINS DOWN)
0.27
0.22
0.17
0.50 BSC
LEAD PITCH
1
25
26
50
76
100
75
51
BOTTOM VIEW
(PINS UP)
5.00 SQ
EXPOSED
PAD
04
22
09
-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 44. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD8159ASVZ1
40°C to +85°C
100-Lead TQFP_EP
SV-100-4
AD8159-EVAL-AC
AC-Coupled Evaluation Board
1 Z = RoHS Compliant Part.
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