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參數(shù)資料
| 型號： | AD8120ACPZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 12/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ANLG VIDEO DELAY LINE 32LFCSP |
| 標準包裝： | 5,000 |
| 類型： | 視頻延遲線 |
| 應用： | HD 視頻 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤，CSP |
| 供應商設備封裝： | 32-LFCSP-EP（5x5） |
| 包裝： | 帶卷 (TR) |
Data Sheet
AD8120
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage
±6 V
Internal Power Dissipation
32-Lead LFCSP at TA = 25°C
3.5 W
Input Voltage
VS 0.3 V to VS+ + 0.3 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature
(Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, for a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
5 mm × 5 mm, 32-Lead LFCSP
36
2
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8120 package is
limited by its junction temperature. The maximum safe junction
temperature for plastic encapsulated devices, as determined by
the glass transition temperature of the plastic, is approximately
150°C. Temporarily exceeding this limit may cause a shift in the
parametric performance due to a change in the stresses exerted
on the die by the package. Exceeding a junction temperature of
175°C for an extended period can result in device failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power dissipation is the voltage between the supply pins (VS+
and VS) times the quiescent current (IS). Power dissipated due
to load drive depends upon the particular application. It is cal-
culated by multiplying the load current by the associated voltage
drop across the device. RMS voltages and currents must be used
in these calculations.
Airflow increases heat dissipation by reducing θJA.
To ensure optimal thermal performance, the exposed paddle
must be in an optimized thermal connection with an external
plane layer.
6
5
4
3
2
1
0
–40
–20
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
07839-
002
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
on a JEDEC Standard 4-Layer Board
ESD CAUTION
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