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參數(shù)資料
型號(hào): AD7606BSTZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 3/36頁(yè)
文件大?。?/td> 0K
描述: IC DAS W/ADC 16BIT 8CH 64LQFP
設(shè)計(jì)資源: Layout Considerations for an Expandable Multichannel Simultaneous Sampling Data Acquisition System Based on AD7606 (CN0148)
標(biāo)準(zhǔn)包裝: 1
類(lèi)型: 數(shù)據(jù)采集系統(tǒng)(DAS),ADC
分辨率(位): 16 b
采樣率(每秒): 200k
數(shù)據(jù)接口: DSP,MICROWIRE?,并聯(lián),QSPI?,串行,SPI?
電壓電源: 模擬和數(shù)字
電源電壓: 2.3 V ~ 5.25 V,4.75 V ~ 5.25 V
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 64-LQFP
供應(yīng)商設(shè)備封裝: 64-LQFP(10x10)
包裝: 托盤(pán)
Data Sheet
AD7606/AD7606-6/AD7606-4
Rev. C | Page 11 of 36
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
AVCC to AGND
0.3 V to +7 V
VDRIVE to AGND
0.3 V to AVCC + 0.3 V
Analog Input Voltage to AGND1
±16.5 V
Digital Input Voltage to AGND
0.3 V to VDRIVE + 0.3 V
Digital Output Voltage to AGND
0.3 V to VDRIVE + 0.3 V
REFIN to AGND
0.3 V to AVCC + 0.3 V
Input Current to Any Pin Except Supplies1
±10 mA
Operating Temperature Range
B Version
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec)
240 (+0)°C
Pb-Free Temperature, Soldering Reflow
260 (+0)°C
ESD (All Pins Except Analog Inputs)
2 kV
ESD (Analog Input Pins Only)
7 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
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