TA = 25°C, unless otherwise noted" />
參數(shù)資料
型號(hào): AD5821BCBZ-REEL
廠商: Analog Devices Inc
文件頁(yè)數(shù): 14/17頁(yè)
文件大小: 0K
描述: IC DAC 10BIT CURRENTSINK 9WLCSP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
產(chǎn)品變化通告: AD5821 Obsolescence 06/Jan/2012
標(biāo)準(zhǔn)包裝: 10,000
設(shè)置時(shí)間: 250µs
位數(shù): 10
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 單電源
功率耗散(最大): 20mW
工作溫度: -30°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 9-UFBGA,WLCSP
供應(yīng)商設(shè)備封裝: 9-WLCSP(1.52 x 1.69)
包裝: 帶卷 (TR)
輸出數(shù)目和類(lèi)型: 1 電流,單極
采樣率(每秒): *
配用: EVAL-AD5821EBZ-ND - BOARD EVALUATION FOR AD5821
AD5821
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to AGND
–0.3 V to +5.5 V
VDD to DGND
–0.3 V to VDD + 0.3 V
AGND to DGND
–0.3 V to +0.3 V
SCL, SDA to DGND
–0.3 V to VDD + 0.3 V
XSHUTDOWN to DGND
–0.3 V to VDD + 0.3 V
ISINK to AGND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
30°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ MAX)
150°C
WLFCSP Power Dissipation
(TJ MAX TA)/θJA
θJA Thermal Impedance1
Mounted on 4-Layer Board
95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperature2
260°C (±5°C)
1 To achieve the optimum θJA, it is recommended that the AD5821
be soldered on a 4-layer board.
2 As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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