參數(shù)資料
型號： A3PE1500-PQG208
元件分類： FPGA
英文描述： FPGA, 38400 CLBS, 1500000 GATES, PQFP208
封裝： 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
文件頁數(shù)： 62/152頁
文件大?。?/td> 4932K
代理商： A3PE1500-PQG208
ProASIC3E DC and Switching Characteristics
v1.2
2 - 5
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 2-1
where:
TA = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal
resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The absolute
maximum junction temperature is 110°C. EQ 2-2 shows a sample calculation of the absolute
maximum power dissipation allowed for an 896-pin FBGA package at commercial temperature and
in still air.
EQ 2-2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
---------------------------------------------------------------------------------------------------------------------------------------
110
°C70°C
–
13.6
°C/W
------------------------------------
5.88 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Pin Count
θ
jc
θ
ja
Units
Still Air
200 ft./min.
500 ft./min.
Plastic Quad Flat Package (PQFP)
208
8.0
26.1
22.5
20.8
C/W
Plastic Quad Flat Package (PQFP) with
embedded heat spreader
208
3.8
16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.9
22.8
21.5
C/W
484
3.2
20.5
17.0
15.9
C/W
676
3.2
16.4
13.0
12.0
C/W
896
2.4
13.6
10.4
9.4
C/W
Table 2-6
Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC =1.425 V)
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.870.920.95
1.001.021.05
1.500
0.830.880.90
0.950.971.00
1.575
0.800.850.87
0.920.940.96
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