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參數(shù)資料
| 型號(hào)： | A3P125-PQG208 |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 21/27頁(yè) |
| 文件大小： | 0K |
| 描述： | IC FPGA 1024MAC 133I/O 208PQFP |
| 產(chǎn)品變化通告： | A3P250,A3P125 Wire Change 12/jan/2012 |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | ProASIC3 |
| RAM 位總計(jì)： | 36864 |
| 輸入/輸出數(shù)： | 133 |
| 門數(shù)： | 125000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 208-BFQFP |
| 供應(yīng)商設(shè)備封裝： | 208-PQFP（28x28） |
| 其它名稱： | 1100-1022 |
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www.microsemi.com/soc
Whether you’re designing at the board or system level,
Microsemi’s customizable System-on-Chip (cSoC) devices and low
power FPGAs are your best choice. The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability,
sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
Now, more than ever,
power matters.
Table of Contents
SmartFusion
Customizable System-on-Chip (cSoC)
4
Fusion
Mixed Signal FPGAs
5
Extended Temperature Fusion
Mixed Signal Integration Down to –55C
Reprogrammable Digital Logic and Configurable Analog
Embedded Flash Memory
6
IGLOO/e
Low Power
Small Package Footprint
High Logic Density
7
IGLOO nano
Low Power
Small Package Footprint
8
IGLOO PLUS
Low Power
Small Package Footprint
High I/O-to-Logic Ratio
9
ProASIC3/E
High Logic Density
High Performance
Low Cost
10
ProASIC3 nano
Small Package Footprint
High Performance
Low Cost
11
ProASIC3L
Low Power
High Logic Density
High Performance
Low Cost
12
Military ProASIC3/EL
Unprecedented Low Power Consumption Across
the Full Military Temperature Range
High-Density Fine-Pitch Ball Grid Packaging
High Performance and Easy In-System Programming
13
Military ProASICPLUS
Industry’s First Military Screened Flash FPGA
Full Processing to MIL-STD-883 Class B
Established Heritage on Commercial and Military Aircraft
13
I/O Table
I/O Counts
14
FPGA Packages
Package Dimensions
16
Axcelerator
18
SX-A
19
MX
20
Design Tools
Design Environment for Microsemi Flash Devices
21
Development Kits
Starter, Evaluation and Demonstration Kits
22
Programmers
FlashPro3 and Silicon Sculptor 3 Programmers
26
Intellectual Property Cores
Microsemi IP Cores
27
Please refer to www.microsemi.com/soc and appropriate product datasheets for the latest device information, valid ordering codes and more
information regarding previous generations of flash and antifuse FPGAs.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| A3P125-PQG208I | 功能描述:IC FPGA 1KB FLASH 125K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3P125-PQG208PS53 | 制造商:Microsemi SOC Products Group 功能描述:ACLA3P125-PQG208PS53 125K GATES 231MHZ 1 |
| A3P125-QNG132 | 功能描述:IC FPGA 1024MAC 133I/O 132QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱:220-1241 |
| A3P125-QNG132I | 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3P125-QNG132T | 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
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