參數(shù)資料
型號: A3P125-PQG208
廠商: Microsemi SoC
文件頁數(shù): 17/27頁
文件大?。?/td> 0K
描述: IC FPGA 1024MAC 133I/O 208PQFP
產(chǎn)品變化通告: A3P250,A3P125 Wire Change 12/jan/2012
標準包裝: 24
系列: ProASIC3
RAM 位總計: 36864
輸入/輸出數(shù): 133
門數(shù): 125000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 208-BFQFP
供應商設備封裝: 208-PQFP(28x28)
其它名稱: 1100-1022
25
www.microsemi.com/soc
Development
Kits
Allowsuserstoevaluate
the functionality of Microsemi’s
Core1553BRMwithouthavingto
createacompleteMIL-STD-1553B
compliant system
FusionAdvancedDevelopmentKit
with two 9 V power supplies
Core1553daughtercard
User’sguide,tutorialand
design example
PCBschematics,layoutfiles
andBOM
Purchasingthekitgivestheowner
therighttotheprogrammingfile
of the demo, but not an evaluation
of the IP. The IP evaluation or
purchase is quoted separately.
Boardfeatures
- MIL-STD-1553B transceiver, two
transformers and two concentric
twinax connectors included on
the Core1553 daughter board
~ MIL-STD-1553B concentric
twinax connectors are center
pin signal high and cylindrical
contact signal low
~ Connectivity is
MIL-C-49142 compliant
~ Evaluate and develop
medium speed on-board data
communications bus solutions
for MIL-STD-1553B /
UK DEF-STAN 00-18 (Pt.2) /
NATO STANAG 3838 AVS /
Avionic Standards Coordinating
Committee Air-Std 50/2
- CAN bus interface support
- Connector to ARINC 429
Daughter Board (CORE429-SA)
Fusion Advanced Development Kit
Core1553-SA
Core1553 Development Kit
Hardware Summary
Ordering Code
Description
Price
CORE1553-DEV-KIT
Core1553 Development Kit
$ 3,620
CORE1553-SA
Core1553 daughter card
$ 2,900
M1AFS-ADV-DEV-KIT-PWR
M1AFS-ADV-DEV-KIT with two 9 V power packs
$ 750
Family
Ordering Code
Name
Device
Price
Power
SmartFusion
A2F-EVAL-KIT*
SmartFusion Evaluation Kit
A2F200M3F-FGG484
$ 99
USB
SmartFusion
A2F500-DEV-KIT
SmartFusion Development Kit
A2F500M3G-FGG484
$ 999
5 V
SmartFusion
MPM-DC-KIT
MPM Daughter Card
none
$ 299
9 V
SmartFusion
MIXED-SIGNAL-DC
Mixed Signal Daughter Card
none
$ 55
N/A
Fusion
M1AFS-EMBEDDED-KIT*
Fusion Embedded Development Kit
M1AFS1500-FGG484
$ 250
USB / 5 V
Fusion
AFS-EVAL-KIT
Fusion Starter Kit
AFS600-FG256
$ 500
9 V
Fusion
M1AFS-ADV-DEV-KIT-PWR
Fusion Advanced Development Kit
M1AFS1500-FGG484
$ 750
9 V
IGLOO
AGLN-NANO-KIT*
IGLOO nano Starter Kit
AGLN250V2-ZVQG100
$ 99
USB
IGLOO
AGL-ICICLE-KIT
IGLOO Icicle Evaluation Kit
AGL125V2-QNG132
$ 150
USB
IGLOO
AGLP-EVAL-KIT
IGLOO PLUS Starter Kit
AGLP125V2-CSG289
$ 299
5 V
IGLOO
M1AGL1000-DEV-KIT
ARM Cortex-M1 IGLOO Development Kit
M1AGL1000V2-FGG484
$ 550
5 V
ProASIC3
A3PE-PROTO-KIT*
ProASIC3 Starter Kit
A3PE1500-PQ208
$ 665
9 V
ProASIC3
M1A3PL-DEV-KIT
ARM Cortex-M1 ProASIC3L Development Kit
M1A3P1000L-FGG484
$ 550
5 V
*Most recommended Kit for each product family
Microsemi offers hardware choices for terrestrial products. Most popular kits are listed in the table and shown in further detail in this section. Full details of these
kits can also be found online with user’s guides and accompanying tutorials.
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相關代理商/技術參數(shù)
參數(shù)描述
A3P125-PQG208I 功能描述:IC FPGA 1KB FLASH 125K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3P125-PQG208PS53 制造商:Microsemi SOC Products Group 功能描述:ACLA3P125-PQG208PS53 125K GATES 231MHZ 1
A3P125-QNG132 功能描述:IC FPGA 1024MAC 133I/O 132QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
A3P125-QNG132I 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
A3P125-QNG132T 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)