A3 22 00 DX Ti m i n g Ch ar ac te r i st i c s (continued) (Wor s t - C as e M i l" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� A1010B-1VQ80C
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 50/98闋�
鏂囦欢澶у皬锛� 0K
鎻忚堪锛� IC FPGA 1200 GATES 80-VQFP COM
妯欐簴鍖呰锛� 90
绯诲垪锛� ACT™ 1
LAB/CLB鏁�(sh霉)锛� 295
杓稿叆/杓稿嚭鏁�(sh霉)锛� 57
闁€鏁�(sh霉)锛� 1200
闆绘簮闆诲锛� 4.5 V ~ 5.5 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 70°C
灏佽/澶栨锛� 80-TQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 80-VQFP锛�14x14锛�
54
A3 22 00 DX Ti m i n g Ch ar ac te r i st i c s (continued)
(Wor s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25掳C)
鈥樷€�1鈥� Speed
鈥楽td鈥� Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Input Module Propagation Delays
tINPY
Input Data Pad to Y
1.9
2.6
ns
tINGO
Input Latch Gate-to-Output
4.6
6.0
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Setup
0.7
0.9
ns
tILA
Latch Active Pulse Width
6.1
8.1
ns
Input Module Predicted Routing Delays1
tIRD1
FO=1 Routing Delay
2.6
3.5
ns
tIRD2
FO=2 Routing Delay
3.4
4.6
ns
tIRD3
FO=3 Routing Delay
4.6
6.1
ns
tIRD4
FO=4 Routing Delay
5.4
7.2
ns
tIRD5
FO=8 Routing Delay
7.0
9.3
ns
Global Clock Network
tCKH
Input Low to High
FO=32
FO=635
7.3
8.5
9.8
11.3
ns
tCKL
Input High to Low
FO=32
FO=635
7.2
9.3
9.6
12.5
ns
tPWH
Minimum Pulse Width High
FO=32
FO=635
3.2
3.9
4.3
5.2
ns
tPWL
Minimum Pulse Width Low
FO=32
FO=635
3.2
3.9
4.3
5.2
ns
tCKSW
Maximum Skew
FO=32
FO=635
1.8
2.4
ns
tSUEXT
Input Latch External Setup
FO=32
FO=635
0.0
ns
tHEXT
Input Latch External Hold
FO=32
FO=635
3.0
3.8
4.0
5.1
ns
tP
Minimum Period (1/fmax)
FO=32
FO=635
5.8
6.8
7.7
9.1
ns
fHMAX
Maximum Datapath Frequency
FO=32
FO=635
172
147
130
110
MHz
Note:
1.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is
based on actual routing delay measurements performed on the device prior to shipment. Optimization techniques may further reduce
delays by 0 to 4 ns.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
A1010B-1VQG80C IC FPGA 1200 GATES 80-VQFP COM
5745175-1 CONN BACKSHELL DB50 DIE CAST
5745172-1 CONN BACKSHELL DB15 DIE CAST
A1010B-2PQG100C IC FPGA 1200 GATES 100-PQFP COM
5748677-4 CONN BACKSHELL DB37 METAL PLATED
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
A1010B-1VQ80I 鍔熻兘鎻忚堪:IC FPGA 1200 GATES 80-VQFP IND RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:ACT™ 1 妯欐簴鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FPBGA锛�27X27锛�
A1010B-1VQ84B 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ACT 1 Series FPGAs
A1010B-1VQ84C 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ACT 1 Series FPGAs
A1010B-1VQ84I 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ACT 1 Series FPGAs
A1010B-1VQ84M 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ACT 1 Series FPGAs