- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄24834 > 935271407115 (NXP SEMICONDUCTORS) LINE TRANSCEIVER, PBCC16 PDF資料下載
參數(shù)資料
| 型號： | 935271407115 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | Buffer和線驅動 |
| 英文描述： | LINE TRANSCEIVER, PBCC16 |
| 封裝： | 3 X 3 X 0.65 MM, PLASTIC, MO-217, SOT-639-2, HBCC-16 |
| 文件頁數(shù)： | 10/21頁 |
| 文件大小： | 518K |
| 代理商： | 935271407115 |
Philips Semiconductors
ISP1104
Advanced USB transceiver
Product data
Rev. 01 — 26 August 2002
18 of 21
9397 750 09784
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
17. Additional soldering information
17.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1
m min.) ensures
solderability, the Ni layer (5
m min.) prevents diffusion, and the Pd layer on top
(0.5
m min.) ensures effective wire bonding.
17.2 (H)BCC packages: reow soldering prole
The conditions for reow soldering of (H)BCC packages are as follows:
Preheating time: minimum 90 s at T = 145 to 155
°C
Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183
°C
Peak temperature:
– Ambient temperature: Tamb(max) = 260 °C
– Device surface temperature: Tcase(max) = 255 °C.
Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 13. (H)BCC footprint and solder resist mask dimensions.
004aaa123
b1
b
b2
Dh
0.05
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
Normal
Terminal
PCB land
Solder resist mask
Stencil mask
Solder land
Corner
0.05
b2
Eh
0.05
0.1
(4
×)
0.3 (8
×)
0.05
Solder resist
Solder stencil
b1
b
Stencil print thickness:
0.1 to 0.12 mm
Cavity
0.05
Dh
Eh
相關PDF資料 |
PDF描述 |
|---|---|
| 935271407118 | LINE TRANSCEIVER, PBCC16 |
| 935271488118 | AVC SERIES, 18 1-BIT DRIVER, TRUE OUTPUT, PDSO56 |
| 935271488112 | AVC SERIES, 18 1-BIT DRIVER, TRUE OUTPUT, PDSO56 |
| 935267932118 | AVC SERIES, 18 1-BIT DRIVER, TRUE OUTPUT, PDSO56 |
| 935271530112 | LOW SKEW CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 935271933518 | 制造商:NXP Semiconductors 功能描述:IC D-TYPE POS TRG DUAL 56VFBGA |
| 935271933551 | 制造商:NXP Semiconductors 功能描述:IC D-TYPE POS TRG DUAL 56VFBGA |
| 935271933557 | 制造商:NXP Semiconductors 功能描述:IC D-TYPE POS TRG DUAL 56VFBGA |
| 935271937518 | 制造商:NXP Semiconductors 功能描述:IC BUFF DVR TRI-ST 16BIT 56VFBGA |
| 935271937551 | 制造商:NXP Semiconductors 功能描述:IC BUFF DVR TRI-ST 16BIT 56VFBGA |
發(fā)布緊急采購，3分鐘左右您將得到回復。