參數(shù)資料
型號(hào)： 935270019512
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC44
封裝： PLASTIC, MS-018, SOT-187-2, LCC-44
文件頁(yè)數(shù)： 39/51頁(yè)
文件大?。?/td> 667K
代理商： 935270019512
Philips Semiconductors
SC16C2550
Dual UART with 16 bytes of transmit and receive FIFOs
and infrared (IrDA) encoder/decoder
Product data
Rev. 02 — 14 March 2003
44 of 47
9397 750 11204
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
12.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 27:
Suitability of IC packages for wave, reow and dipping soldering methods
Mounting
Package[1]
Soldering method
Wave
Reow[2]
Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable[3]
suitable
Surface mount
BGA, LBGA, LFBGA,
SQFP, TFBGA, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[5][6]
suitable
SSOP, TSSOP, VSO,
VSSOP
not recommended[7]
suitable
相關(guān)PDF資料
PDF描述
935270019518 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC44
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