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參數(shù)資料
| 型號： | 935267053005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 6/23頁 |
| 文件大小： | 331K |
| 代理商： | 935267053005 |
January 2005
Page 14 of 23
Public
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips
‘General Specification for 6” Wafer’.
10.1 Storage Recommendations
Unsawn/sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
15 ... 25 °C
Climate atmosphere:
40 ... 60 % r.h. or dried N2 (only unsawn wafers!)
Duration of storage:
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Possible Forms of Delivery
10.2.1 Packing of Unsawn Wafers
Delivery form:
wafer box
10.2.2 Packing of Sawn Wafers
Delivery form:
Film Frame Carrier (standard Philips carrier type P7)
Foil thickness:
0.55 ... 0.85 mm
Foil material:
sticky foil
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