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參數資料
| 型號： | 935267053005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數： | 19/23頁 |
| 文件大?。?/td> | 331K |
| 代理商： | 935267053005 |
January 2005
Page 5 of 23
Public
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn
wafers on FFC of ICODE1 Label ICs (Cres = 97 pF) on a Philips 6C15 IDFW process and is the
base for delivery of tested ICODE1 Label ICs.
General recommendations are given for storage, handling and processing of wafers as well as
assembly of labels.
Reference documents:
MIL-STD 883D Method 3023
MIL-STD 883D Method 3015
SNW-FQ-627
PICTOH-QS007
General Specification for 6” Wafer
General Quality Specification
ICODE Label IC, Coil Design Guide
This product specification is valid for mask revision: VCOL1V0
NK: O
MB: B
4 Ordering Information
Following ordering options are available:
Type Name
Description
Ordering Code
SL1 ICS31 01W/N5D
Sawn wafer on foil (FFC), 150 m, inked and mapped
9352 670 53005
SL1 ICS31 01U/N5D
Unsawn wafer, 150 m, inked and mapped
9352 670 50025
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