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參數(shù)資料
| 型號： | 935262403118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 時(shí)鐘/數(shù)據(jù)恢復(fù)及定時(shí)提取 |
| 英文描述： | 0 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 封裝： | 3 MM, PLASTIC, TSSOP-8 |
| 文件頁數(shù)： | 20/32頁 |
| 文件大?。?/td> | 711K |
| 代理商： | 935262403118 |
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Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specication
16 April 1999
27 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
14.4 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[3]
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[4]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[5]
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[6]
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
15. Revision history
Table 31: Suitability of IC packages for wave, reow and dipping soldering methods
Mounting
Package
Soldering method
Wave
Reow [1] Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable [2]
suitable
Surface mount
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP,
HTSSOP, SMS
not suitable [3]
suitable
PLCC [4], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended [4] [5] suitable
SSOP, TSSOP, VSO
not recommended [6]
suitable
Rev Date
CPCN
Description
01
990416
-
This data sheet supersedes the version of 1998 Mar 25 (9397 750 03282):
The format of this specication has been redesigned to comply with Philips Semiconductors’
new presentation and information standard
Added paragraph in Section 8.5 “Voltage-low detector and clock monitor” on page 5
Added Figure 14 to 17 on page 18 in Section 10.
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