參數(shù)資料
型號(hào)： 935200940112
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PDIP52
封裝： PLASTIC, SOT-247, SDIP-52
文件頁(yè)數(shù)： 25/39頁(yè)
文件大?。?/td> 236K
代理商： 935200940112
March 1994
31
Philips Semiconductors
Objective specication
Integrated PAL and PAL/NTSC TV
processors
TDA8360; TDA8361; TDA8362
PACKAGE OUTLINE
Fig.14 52-lead shrink dual in-line; plastic (SOT247AG).
Dimensions in mm.
handbook, full pagewidth
1
27
26
1.3 max
14.1
13.7
47.92
47.02
4.57
max
5.08
max
0.51
min
3.2
2.8
seating
plane
0.18 M
0.53
max
1.778
(25x)
1.73
max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA267
52
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260
°C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300
°C, it must not be in contact for more than 10 s; if
between 300 and 400
°C, for not more than 5 s.
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