參數(shù)資料
型號(hào)： 933841600005
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 顯示驅(qū)動(dòng)器
英文描述： LIQUID CRYSTAL DISPLAY DRIVER, U
封裝： DIE
文件頁(yè)數(shù)： 35/44頁(yè)
文件大?。?/td> 192K
代理商： 933841600005
2001 Oct 02
40
Philips Semiconductors
Product specication
Universal LCD driver for low multiplex rates
PCF8576
17.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
相關(guān)PDF資料
PDF描述
935064190005 LIQUID CRYSTAL DISPLAY DRIVER, U
0560-6600-01 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
0560-6600-02 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
0560-6600-03 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
0560-6600-04 HDSL & MDSL MAGNETICS For Conexant Bt8960 and Bt8970
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
933844001 制造商:Hirschmann Electronics GmbH & Co Kg 功能描述:TEST LEAD BLACK 1.2MBNC TO 0.64MM SKT 制造商:Hirschmann Electronics GmbH & Co Kg 功能描述:TEST LEAD, BLACK, 1.2M,BNC TO 0.64MM SKT 制造商:Hirschmann Electronics GmbH & Co Kg 功能描述:TEST LEAD, BLACK, 1.2M,BNC TO 0.64MM SKT, Lead Length:1.2m, Insulator Colour:Black, Test Connector Type A:BNC Plug, Test Connector Type B:Probe, Voltage Rating:60V, SVHC:No SVHC (20-Jun-2013), Connector Type A:BNC Plug, Connector , RoHS Compliant: Yes 制造商:SKS KONTAKTTECHNIK GMBH 功能描述:BNC-0.64MM ADAPTER CABLE
9338-5M 制造商:PRO ELEC 功能描述:EXTENSION LEAD 3WAY 5M 制造商:PRO ELEC 功能描述:EXTENSION LEAD, 3WAY, 5M
933861-000 功能描述:焊料和屏蔽管 SO63-3-9030 RoHS:否 制造商:TE Connectivity / Raychem 類(lèi)型:Shield Terminators 材料:Polyvinylidene Fluoride 內(nèi)徑:5.08 mm 長(zhǎng)度:16.5 mm 最低收縮溫度: 系列:S03
933871-1 制造商:TE Connectivity 功能描述:GUIDE, MODIFIED - Bulk
9-338728-0 功能描述:集管和線殼 MICROM. MOB SMD CON RoHS:否 產(chǎn)品種類(lèi):1.0MM Rectangular Connectors 產(chǎn)品類(lèi)型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類(lèi)型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類(lèi)型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*