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參數(shù)資料
| 型號： | 908E425 |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | Integrated Quad Half H-Bridge with Power Supply, Embedded MCU, and LIN Serial Communication |
| 中文描述： | 綜合四半僅符合電源橋，嵌入式微控制器和LIN串行通信 |
| 文件頁數(shù)： | 5/49頁 |
| 文件大小： | 490K |
| 代理商： | 908E425 |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
908E425
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions
(1)
Microcontroller Chip Supply Voltage
V
SUP(
SS
)
V
SUP(
PK
)
V
DD
- 0.3 to 28
- 0.3 to 40
- 0.3 to 6.0
V
Input Pin Voltage
Analog Chip
Microcontroller Chip
V
IN
(ANALOG)
V
IN
(MCU)
- 0.3 to 5.5
V
SS
- 0.3 to V
DD
+ 0.3
V
Maximum Microcontroller Current per Pin
All Pins Except VDD, VSS, PTA0 PTA6, PTC0 PTC1
Pins PTA0 PTA6, PTC0 PTC1
I
PIN
(1)
I
PIN
(2)
±15
± 25
mA
Maximum Microcontroller V
SS
Output Current
I
MVSS
100
mA
Maximum Microcontroller V
DD
Input Current
I
MVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions
(1)
V
BUS(SS)
V
BUS(DYNAMIC)
-18 to 28
40
V
ESD Voltage
(2)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
V
ESD
± 3000
± 150
± 500
V
THERMAL RATINGS
Storage Temperature
T
STG
–
°
C
Ambient Operating Temperature
T
A
0 to
85
°
C
Operating Case Temperature
(3)
T
C
0 to
85
°
C
Operating Junction Temperature
(4)
T
J
0 to 125
°
C
Peak Package Reflow Temperature During Solder Mounting
(5)
T
SOLDER
245
°
C
Notes
1.
2.
Transient capability for pulses with a time of t < 0.5 sec.
ESD voltage testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), ESD voltage testing is
performed in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
, ESD voltage testing is performed in accordance with
Charge Device Model, robotic (C
ZAP
= 4.0 pF).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
3.
4.
5.
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