參數(shù)資料
型號： 7140DG
廠商： Aavid Thermalloy
文件頁數(shù)： 6/116頁
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 1,000
類型： 插件板級
冷卻式包裝： TO-220
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 0.700"（17.78mm）
寬： 0.90"（22.86mm）
機座外的高度（散熱片高度）： 0.375"（9.52mm）
溫升時的功耗： 1.5W @ 50°C
在強制氣流下的熱敏電阻： 在 200 LFM 時為10.0°C/W
自然環(huán)境下的熱電阻： 20.8°C/W
材質(zhì)： 銅
材料表面處理： 錫
其它名稱： 043239
103
A
C
CESSORIES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Insulators – Mica and ThermalsilTM III
Mica and Thermalsil
TM III
ORDERING INFORMATION
Part number
Description
Device
"A" Dim
"B" Dim
"C" Dim
"D" Dim
Figure
56-77-9G
Mica
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
B
56-03-2G
Mica
TO-3
42.04 (1.655)
27.00 (1.063)
3.96 (0.156)
1.57 (0.062)
A
53-77-9G
ThermalsilTM III
TO-220
18.42 (0.725)
13.21 (0.520)
4.32 (0.170)
2.92 (0.115)
B
53-03-2G
ThermalsilTM III
TO-3
42.04 (1.655)
27.00 (1.063)
3.96 (0.156)
1.57 (0.062)
A
Property
Electrical
Dielectric strength
172 X 103 volts/mm (4500 volts/mil)
0.025 mm to 0.076 mm thick in air (1 to 3 mils thick in air)
Dielectric constant
6.5 to 8.7
Dissipation factor
0.0001-0.0004 @ 106 Hz
Volume resistivity
1015 ohm-cm
Physical
Modules of elasticity in tension
172 X 103 Mpa (25 X 106) psi
Tensile strength
310 Mpa (45,000 psi)
Hardness mohs, shore
3.0, 115
Compressive strength
2.21 X 108 Pa (32,000 psi)
Specific gravity
2.9
Thermal
Thermal conductivity
0.528 W/(m °C ) (0.30 Btu/hr-ft °F)
Coefficient of thermal expansion
3.24 X 10-5 °C (1.8 X 10-5 °F)
Specific heat
0.084 KJ/Kg °C (0.02 Btu/Lb °F)
Melting point
1275°C (2327 °F)
Max. operating temperature
550 °C (1022 F)
TYPICAL PROPERTIES FOR MICA INSULATORS
Thermalsil III provides excellent thermal conductivity
and electrical resistance. It is used as an electrically-isolat-
ing interface material composed of silicone elastomer
binder with a thermally conductive filler. It is reinforced
with glass cloth to resist tearing and cut-through due to
burrs on transistors or heat sinks.
Thermalsil III eliminates the need for grease application
and conforms to mounting surfaces under clamping pres-
sure for optimum heat conduction. The finely woven glass
cloth provides the thinnest possible matrix for enhanced
thermal resistance. Thermalsil III is available in any con-
figuration with adhesive backing.
Mica insulators provide high maximum operating temper-
atures (550°C) and excellent electrical properties.
FIGURE A
FIGURE B
"B"
30.15
(1.187)
10.92
(0.430)
"A"
1.83
(0.072)
"C"
DIA
TYP(2)
"D"
DIA
TYP(2)
"A"
"B"
"C"
"D"
DIA
Property
Typical value 25°C
Test method
Electrical
Dielectric constant
2.5@50 Hz
ASTM D-150
2.5@103 Hz
2.5@106 Hz
Dielectric breakdown voltage 26.3 x 103 volts/mm (667 volts/mil)
ASTM D-149
Volume resistivity
5.7 x 1015 ohm-cm
ASTM D-257
Dielectric dissipation factor
0.008@50 Hz
ASTM D-150
0.004 @103 Hz
0.004 @106 Hz
Physical
Thickness
0.15mm
(0.006 inch)
Color
Gray-Green
Tensile strength
6.1 x 107 Pa (8786 psi)
Hardness, shore A
87
Elongation
2% or less
Thermal
Thermal conductivity
0.92 W/(m °C ) (0.532 Btu/hr. ft °F)
Flame resistance
UL 94V-0
UL card #E-58126 (S)
Service temperature
-60°C to 180°C
(-76°F to 356°F)
TYPICAL PROPERTIES FOR THERMALSIL
TM III
相關PDF資料
PDF描述
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6225B-MTG BOARD LEVEL HEAT SINK
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