參數(shù)資料
型號： 7140DG
廠商： Aavid Thermalloy
文件頁數(shù)： 33/116頁
文件大小： 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓模塊： How to Select a Heat Sink
標準包裝： 1,000
類型： 插件板級
冷卻式包裝： TO-220
固定方法： 夾和 PC 引腳
形狀： 矩形
長度： 0.700"（17.78mm）
寬： 0.90"（22.86mm）
機座外的高度（散熱片高度）： 0.375"（9.52mm）
溫升時的功耗： 1.5W @ 50°C
在強制氣流下的熱敏電阻： 在 200 LFM 時為10.0°C/W
自然環(huán)境下的熱電阻： 20.8°C/W
材質(zhì)： 銅
材料表面處理： 錫
其它名稱： 043239
23
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
5085, 5086, 5087
Extruded epoxy attach on heat sink with straight fins
Extruded epoxy attach on heat sink
with straight fins attaches to 24, 28,
and 40 pin DIP packages quickly and
easily. May be added before or after
final board assembly. No additional
board space is required.
13.46
(0.530)
4.83
(0.190)
"A"
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°C/W
at
t
20
0
20
40
60
80
100
01
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°C
508600
508500
508700
ORDERING INFORMATION
Part Number
DIP Package
“A” Dim
508500B00000G
24 pin
31.75 (1.250)
508600B00000G
28 pin
36.83 (1.450)
508700B00000G
40 pin
50.80 (2.000)
Material: Aluminum
Finish: Black Anodize
6284
Extruded epoxy attach heat sink
which requires no additional board
space is suitable for narrow DIP
packages. May be added before
or after final board assembly. No
additional board space is required.
Attaches to 28 pin DIP.
13.46
(0.530)
12.06
(0.475)
36.83
(1.450)
REF
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
25
0
20
40
60
80
100
01
2
3
4
5
20
15
5
10
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
ORDERING INFORMATION
Part Number
Description
6284BG
Extruded epoxy attach heat sink for 28 pin DIP
Material: Aluminum
Finish: Black Anodize
DIPS
5011, 5012
Extruded epoxy attach heat sink with straight fins
Extruded epoxy attach heat sink with
straight fins attaches to 14 and 16 pin
DIP packages quickly and easily. May be
added before or after final board assembly.
No additional board space is required.
Available in two fin directions.
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
100
0
20
40
60
80
100
0.0
0.4
0.8
1.2
1.6
2.0
80
60
20
40
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
501200
501100
501
1–
50
12
19.05
(0.750)
REF
6.35
(0.250)
REF
4.82
(0.190)
ORDERING INFORMATION
Part Number
Description
Figure
501100B00000G
Extruded epoxy attach heat sink with straight fins
A
501200B00000G
Extruded epoxy attach heat sink with straight fins
B
Material: Aluminum
Finish: Black Anodize
4.83
(0.190)
18.57
(0.730)
6.35
(0.250)
FIGURE A
FIGURE B
For epoxy information see pages 114-115.
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
Grease
Epoxy
&
page112
相關(guān)PDF資料
PDF描述
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6225B-MTG BOARD LEVEL HEAT SINK
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