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| 型號(hào)： | 68HC705PL4B |
| 廠商： | Motorola, Inc. |
| 英文描述： | 8-Bit Microcontroller Units (MCU).(8位微控制器) |
| 中文描述： | 8位微控制器單元（MCU）。（8位微控制器） |
| 文件頁(yè)數(shù)： | 90/98頁(yè) |
| 文件大?。?/td> | 1019K |
| 代理商： | 68HC705PL4B |
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GENERAL RELEASE SPECIFICATION
April 30, 1998
MOTOROLA
14-2
MECHANICAL SPECIFICATIONS
MC68HC05PL4
REV 2.0
14.3
28-PIN SSOP
-D-
A
- T -
e
b
A
1
N
1.00 DIA.
H
3
4
4
A
2
6
SIDE VIEW
END VIEW
TOP VIEW
SEATING
-E-
1
2
3
DSEE
- C -
BOTTOM VIEW
E/2
D/2
1.00
1.00
DIA2.36
7
8
P
E
-
I
LI
P
C
0.076
M
+
E
M
0.20
S
D
0.12
M
T
E
+
b1
c
b
c1
BASE METAL
8
10
SECTION G-G
WITH LEAD FINISH
12-16
°
PARTING LINE
DETAIL 'A'
5
L1
G
G
0.25 BSC
GAUGE PLANE
SEATING PLANE
L
0
°
MIN.
0.235 MIN
R
7.
6.
CONTROLLING DIMENSION: MILLIMETERS.
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25mm FROM LEAD TIPS.
THIS PACKAGE OUTLINE DRAWING COMPLIES WITH
JEDEC SPECIFICATION NO. MO-150 FOR THE LEAD COUNTS SHOWN
9.
1.
2.
MAXIMUM DIE THICKNESS ALLOWABLE IS 0.43mm (.017 INCHES).
DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
8.
5.
4.
3.
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE.
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
AT THE PARTING LINE, MOLD FLASH OR
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT
"T" IS A REFERENCE DATUM.
NOTES:
10.
11.
8
0
DIMENSIONS IN MM
MIN.
NOM.
1.73
0.05
1.68
0.25
0.25
0.09
MAX.
1.99
L
1
N
M
H
e
E
D
A
A2
b
b1
c
A
O
L
Y
M
B
S
4
0.65 BSC
7.80
1.86
0.13
1.73
1.78
0.38
0.33
0.20
0.21
5.20
5.30
5.38
7.65
0.63
0.75
1.25 REF.
7.90
0.95
28
10.07
10.20
10.33
0.30
c1
0.09
0.15
0.16
—
—
L1
O
N
E
T
6
4
4
5
10
10
10
8,10
R
0.09
0.15
.407
.212
.402
.209
.397
.205
28
4
.037
.311
.307
.030
.025
.301
.066
.010
.010
.004
.004
.002
.068
.078
.008
.070
.015
.013
.008
.006
.068
.005
.073
.0256 BSC
NOM.
MAX.
MIN.
DIMENSIONS IN INCH
0
8
.012
.006
—
—
.049 REF.
.004
.006
M
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