
0
Total:
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
45
1
HAST
HRS
9921
No FA
100
130C, 85%R.H.,5.5V
90
0
1
HAST
HRS
Total:
9921
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
200
130C, 85% R.H.
45
0
HAST, NO BIAS
HRS
9921
200
130C, 85% R.H.
55
0
0
HAST, NO BIAS
HRS
Total:
9921
Assembly Site:
Pin Count:
Package Type:
ATP (Amkor, PI)
32
TSOP
Body Size:
Mold Compound:
8x20x1.0
Sumitomo 7351T
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
0106
9913
to
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
J-STD-020
J-STD-020
125C
30C/60% R.H.
235C +5/-0C
MIL-STD-883-2009
8
8
8
8
8
8
0
0
PRECONDITION U/S
ULTRASOUND
STORAGE LIFE
MOISTURE SOAK
CONVECTION REFLOW
EXTERNAL VISUAL
9913
HRS
HRS
PASS
240
3
0
0
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
1000
125C, 6.0 VOLTS
85
0
HIGH VOLTAGE LIFE
HRS
9913
1000
125C, 6.0 VOLTS
256
2
HIGH VOLTAGE LIFE
HRS
0106
iBATT
LEAK
2
Total:
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
MIL-STD-883-2003
3
0
SOLDERABILITY
9913
MIL-STD-883-2012 : TOP & SIDE VIEW
6
0
X-RAY
9913