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參數(shù)資料
| 型號(hào)： | 32TSOP |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | PACKAGE RELIABILITY REPORT |
| 中文描述： | 包裝可靠性報(bào)告 |
| 文件頁數(shù)： | 4/11頁 |
| 文件大小： | 33K |
| 代理商： | 32TSOP |
Assembly Site:
Pin Count:
Package Type:
ATK (Amkor, K)
28
TSOP
Body Size:
Mold Compound:
8x13.4x0.965
Sumitomo 7351T
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
0303
0223
to
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
1000
125C, 7.0 VOLTS
80
0
HIGH VOLTAGE LIFE
HRS
0223
1000
125C, 7.0 VOLTS
160
0
HIGH VOLTAGE LIFE
HRS
0223
1000
125C, 6.0 VOLTS
77
0
0
HIGH VOLTAGE LIFE
HRS
Total:
0303
Assembly Site:
Pin Count:
Package Type:
ATK (Amkor, K)
32
TSOP
Body Size:
Mold Compound:
8x20x1.0
Sumitomo 7351T
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
0303
0038
to
MOISTURE SENSITIVITY LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
J-STD-020
125C
30C/60% R.H.
235C +5/-0C
MIL-STD-883-2009
J-STD-020
8
8
8
8
8
8
0
ULTRASOUND
STORAGE LIFE
MOISTURE SOAK
CONVECTION REFLOW
EXTERNAL VISUAL
PRECONDITION U/S
0038
24
240
3
HRS
HRS
PASS
0
0
0
0
Total:
OPERATING LIFE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
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