參數(shù)資料
型號: 32TSOP
廠商: Maxim Integrated Products, Inc.
英文描述: PACKAGE RELIABILITY REPORT
中文描述: 包裝可靠性報告
文件頁數(shù): 5/11頁
文件大?。?/td> 33K
代理商: 32TSOP
1000
125C, 6.0 VOLTS
116
0
HIGH VOLTAGE LIFE
HRS
0038
1000
125C, 6.0 VOLTS
77
0
0
HIGH VOLTAGE LIFE
HRS
Total:
0303
PACKAGE TESTS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
MIL-STD-883-2003
3
0
SOLDERABILITY
0038
MIL-STD-883-2012 : TOP & SIDE VIEW
MIL-STD-883-2016
MIL-STD-883-2015
MIL-STD-883-2004 : COND B2
6
6
6
6
0
0
0
0
0
X-RAY
PHYSICAL DIMENSIONS
MARK PERMANENCY
LEAD INTEGRITY
0038
Total:
PRECONDITIONING LEVEL 3
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
24
240
3
125C
30C/60% R.H.
235C +5/-0C
315
315
315
STORAGE LIFE
MOISTURE SOAK
CONVECTION REFLOW
HRS
HRS
PASS
Total:
0038
0
0
TEMPERATURE CYCLE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
1000
-55C TO 125C
77
0
0
TEMP CYCLE
CYS
Total:
0038
TEMPERATURE HUMIDITY BIAS
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
100
130C, 85%R.H.,5.5V
77
0
0
HAST
HRS
Total:
0038
UNBIASED MOISTURE RESISTANCE
DESCRIPTION
READPOINT
CONDITION
QTY
FAILS
DATE CODE
FA#
200
130C, 85% R.H.
45
0
0
HAST, NO BIAS
HRS
Total:
0038
Assembly Site:
Pin Count:
Package Type:
ATP (Amkor, PI)
28
TSOP
Body Size:
Mold Compound:
8x13.4x0.965
Sumitomo 7351T
Lead Frame:
Lead Finsh:
Die Attach:
Bond Wire / Size:
Flammability:
Theta JA:
Theta JC:
Stamped Copper C7025
SnPb Plate
8361J Epoxy Silverfilled Ablebond
Au / 1.0 mil
UL 94-V0
Assembly Information:
Moisture Sensitivity
(JEDEC J-STD20A)
Date Code Range:
Level 3
9924
9921
to
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