參數(shù)資料
型號： μPD78P058FY
廠商： NEC Corp.
元件分類： 8位微控制器
英文描述： 8 Bit Single Chip Microcontrollers
中文描述： 8位單片機(jī)微控制器
文件頁數(shù)： 64/74頁
文件大?。?/td> 520K
代理商： ΜPD78P058FY
μ
PD78P058FY
64
9.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78P058FY should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales represen-
tative.
Table 9-1. Surface Mount Type Soldering Conditions
μ
PD78P058FYGC-3B9 : 80-pin plastic QFP (14
×
14 mm, Resin thickness: 2.7 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
IR35-207-3
VPS
VP15-207-3
Wave soldering
WS60-207-1
Pin partial
heating
—
Note
The number of days for storage after the dry pack has been opened. Storage conditions are 25
°
C and 65%
RH max.
Cautions
1. Use of more than one soldering method should be avoided (except the pin partial heating
method).
2. The
μ
PD78P058FYGC-8BT being under development, soldering conditions have not been fixed.
Package peak temperature: 235
°
C, Reflow time: 30 seconds or below (210
°
C or
higher), Number of reflow processes: 3 max.,
Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C for 20 hours)
Package peak temperature: 215
°
C, Reflow time: 40 seconds or below (200
°
C or
higher), Number of reflow processes: 3 max.,
Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C for 20 hours)
Solder temperature: 260
°
C or below, Flow time: 10 seconds or below, Number of flow
processes: 1, Preheating temperature: 120
°
C or below (package surface temperature),
Exposure limit: 7 days
Note
(after that, prebaking is necessary at 125
°
C for 20 hours)
Pin temperature: 300
°
C or below,
Time: 3 seconds or below (per side of device)
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