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參數(shù)資料
| 型號(hào)： | μPC8126K |
| 廠商： | NEC Corp. |
| 英文描述： | 900 MHz Band Direct Quadrature Modulator IC(900 MHz 頻帶直接積分調(diào)節(jié)器芯片) |
| 中文描述： | 900兆赫頻帶的直接正交調(diào)制器集成電路（900兆赫的頻帶直接積分調(diào)節(jié)器芯片） |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 189K |
| 代理商： | ΜPC8126K |
Preliminary Data Sheet P13488EJ1V0DS00
17
μ
PC8126K
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the track length between the ground pins as short as possible.
(4) Connect a bypass capacitor (example 1 000 pF) to the V
CC
pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended condition. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 2, Exposure limit
Note
: None
IR35-00-2
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
–
Note
After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
.
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