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參數(shù)資料
| 型號(hào)： | XR1005 |
| 元件分類： | 上/下變頻器 |
| 英文描述： | RF/MICROWAVE DOWN CONVERTER |
| 封裝： | DIE-10 |
| 文件頁數(shù)： | 3/7頁 |
| 文件大?。?/td> | 402K |
| 代理商： | XR1005 |
1
2
3
4
5
6
7
8
10
9
Vg1
Vg2
IF2
LO
Vd2
IF1
Vd1
RF
1
2
3
4
5
6
7
8
1.608
(0.063)
1.945
(0.077)
1.678
(0.066)
2.478
(0.098)
3.278
(0.129)
3.970
(0.156)
1.488
(0.059)
3.677
(0.145)
3.278
(0.129)
10
1.678
(0.066)
9
2.478
(0.098)
3.077
(0.121)
0.0
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Page 3 of 8
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App Note [2]
(Note: Engineering designator is 22REC0393)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.787 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Bond Pad #3 (IF1)
Bond Pad #4 (Vd2)
Bond Pad #5 (LO)
Bond Pad #6 (Vg2b)
Bond Pad #7 (Vg2)
Bond Pad #8 (Vg2a)
Bond Pad #9 (IF2)
Bond Pad #10 (Vg1)
RF
Vd1
IF1
LO
Vd2
IF2
Vg2
Vg1
XR1005
May 2005 - Rev 13-May-05
19.0-26.0 GHz GaAs MMIC
Receiver
R1005
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相關(guān)代理商/技術(shù)參數(shù) |
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| XR-1005CN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Filter |
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| XR1005D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog Filter |
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| XR1005-QD_07 | 制造商:MIMIX 制造商全稱:MIMIX 功能描述:19.0-26.0 GHz GaAs Receiver QFN, 7x7 mm |
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