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| 型號(hào)： | XQ2V3000 |
| 廠商： | Xilinx, Inc. |
| 英文描述： | QPro Virtex-II 1.5V Military QML Platform FPGAs |
| 中文描述： | QPro的Virtex - II 1.5V的軍事QML第平臺(tái)FPGA |
| 文件頁(yè)數(shù)： | 75/128頁(yè) |
| 文件大?。?/td> | 2738K |
| 代理商： | XQ2V3000 |
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QPro Virtex-II 1.5V Military QML Platform FPGAs
DS122 (v1.1) January 7, 2004
Product Specification
www.xilinx.com
1-800-255-7778
75
R
QPro Virtex-II Device/Package Combinations and Maximum I/Os Available
This section provides
QPro Virtex-II Device/Package
Combinations and Maximum I/Os Available
and
QPro
Virtex-II Pin Definitions
, followed by pinout tables for the
following packages:
FG456 Fine-Pitch BGA Package
BG575 Standard BGA Package
BG728 Standard BGA and CG717 Ceramic CGA
Packages
CF1144 Ceramic Flip-Chip Fine-Pitch CGA Package
QPro Virtex-II devices are available in both wire-bond and
flip-chip packages. The basic package dimensions are
listed in
Table 72
. See
Figure 52
through
Figure 56
for a
more complete mechanical description of each available
package.
Table 73
shows the maximum number of user I/Os
possible for each available package. There are four pack-
age type definitions:
FG denotes plastic wire-bond fine-pitch BGA (1.00 mm
pitch).
BG denotes plastic wire-bond ball grid array (1.27 mm
pitch).
CG denotes hermetic ceramic wire-bond column grid
array (1.27 mm pitch).
CF denotes non-hermetic ceramic flip-chip column grid
array (1.00 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD).
QPro Virtex-II
Pin Definitions
This section describes the pinouts for QPro Virtex-II devices
in the following packages:
FG456: wire-bond fine-pitch BGA of 1.00 mm pitch
BG575 and BG728: wire-bond BGA of 1.27 mm pitch
CG717: wire-bond ceramic column grid of 1.27 mm
pitch
CF1144: Ceramic flip-chip fine-pitch column grid of
1.00 mm pitch
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards (see the
QPro Virtex-II Data
Sheet
). Global pins, including JTAG, configuration, and
power/ground pins, are listed at the end of each table.
Table 74
provides definitions for all pin types.
All QPro Virtex-II pinout tables are available on the distribu-
tion CD-ROM, or on the web (at
http://www.xilinx.com
).
Table 72:
Package Information
Package
FG456
BG575
BG728 & CG717
CF1144
Pitch (mm)
1.00
1.27
1.27
1.00
Size (mm)
23 x 23
31 x 31
35 x 35
35 x 35
Table 73:
QPro Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance
Information)
Package
Available I/Os
XQ2V1000
XQ2V3000
XQ2V6000
FG456
324
-
-
BG575
328
-
-
BG728
-
516
-
CG717
-
516
-
CF1144
-
-
824
Notes:
1.
The BG728 and CG717 packages are pinout (footprint) compatible.
ds122_1_1.fm Page 75 Wednesday, January 7, 2004 9:15 PM
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XQ2V3000-4BG575M | QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG575N | QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG728M | QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG728N | QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4CF1144M | QPro Virtex-II 1.5V Military QML Platform FPGAs |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XQ2V3000-4BG575M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG575N | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG728M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPro Virtex-II 1.5V Military QML Platform FPGAs |
| XQ2V3000-4BG728N | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPro Virtex-II 1.5V Platform FPGAs |
| XQ2V3000-4CF1144M | 制造商:XILINX 制造商全稱:XILINX 功能描述:QPro Virtex-II 1.5V Military QML Platform FPGAs |
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