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參數(shù)資料
| 型號： | XPC860PZP50D4 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:18-5 |
| 中文描述： | 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 |
| 封裝： | PLASTIC, BGA-357 |
| 文件頁數(shù)： | 7/76頁 |
| 文件大小： | 857K |
| 代理商： | XPC860PZP50D4 |
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MOTOROLA
MPC860 Family Hardware Specifications
7
Thermal Characteristics
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC860.
Table 3-2. Maximum Tolerated Ratings
(GND = 0 V)
Rating
Symbol
Value
Unit
Supply Voltage
1
1
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
Caution
: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction applies
to power-up and normal operation (that is, if the MPC860 is unpowered, voltage greater than 2.5 V must not be
applied to its inputs).
Minimum temperatures are guaranteed as ambient temperature, T
junction temperature, T
j
.
V
DDH
–0.3 to 4.0
V
V
DDL
–0.3 to 4.0
V
KAPWR
–0.3 to 4.0
V
VDDSYN
–0.3 to 4.0
V
Input Voltage
2
2
V
in
GND – 0.3 to VDDH
V
Temperature
3
(Standard)
3
A
. Maximum temperatures are guaranteed as
T
A(min)
0
C
T
j(max)
95
C
Temperature
3
(Extended)
T
A(min)
–40
C
T
j(max)
95
C
Storage Temperature Range
T
stg
–55 to 150
C
Table 4-3. MPC860 Thermal Resistance Data
Rating
Environment
Symbol
Rev A
Rev
B, C, D
Unit
Junction to Ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Natural Convection
Single layer board (1s)
R
θ
JMA 3
JA 2
31
40
°C/W
Four layer board (2s2p)
R
θ
20
25
Air Flow (200 ft/min)
Single layer board (1s)
R
θ
JMA3
26
32
Four layer board (2s2p)
R
θ
JMA3
16
21
Junction to Board
4
R
θ
JB
8
15
Junction to Case
5
R
θ
JC
5
7
Junction to Package Top
6
Natural Convection
Ψ
JT
1
2
Air Flow (200 ft/min)
2
3
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