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參數(shù)資料
| 型號(hào)： | XPC860DPZP50D4 |
| 廠商： | MOTOROLA INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle |
| 中文描述： | 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357 |
| 封裝： | PLASTIC, BGA-357 |
| 文件頁(yè)數(shù)： | 73/76頁(yè) |
| 文件大?。?/td> | 857K |
| 代理商： | XPC860DPZP50D4 |
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MOTOROLA
MPC860 Family Hardware Specifications
73
Mechanical Dimensions of the PBGA Package
14.2 Mechanical Dimensions of the PBGA Package
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to Motorola Application Note,
Plastic Ball Grid Array
(order number: AN1231/D), available from your local Motorola
sales office. Figure 14-75 shows the mechanical dimensions of the PBGA package.
Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature
of the PBGA Package
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
12345678910111213141516171819
SIDE VIEW
BOTTOM VIEW
18X
4X
357X
b
TOP VIEW
A2
A3
e
0.3 M C
D
A
A1
D2
0.15 M
C
E
E2
0.2 C
A
B
0.2
D1
E1
A B
0.25 C
0.35 C
C
NOTES:
1. Dimensions and tolerancing per ASME Y14.5M, 1994.
2. Dimensions in millimeters.
3. Dimension b is the maximum solder ball diameter
measured parallel to datum C.
DIM
A
A1
MIN
MAX
2.05
0.70
1.35
0.90
0.90
MILLIMETERS
---
0.50
0.95
0.70
0.60
25.00 BSC
22.86 BSC
22.40
1.27 BSC
25.00 BSC
22.86 BSC
22.40
A2
A3
b
D
D1
D2
e
E
E1
E2
22.60
22.60
Case No. 1103-01
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