參數(shù)資料
型號： XPC860DPZP50D4
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
中文描述： 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357
封裝： PLASTIC, BGA-357
文件頁數(shù)： 39/76頁
文件大?。?/td> 857K
代理商： XPC860DPZP50D4
MOTOROLA
MPC860 Family Hardware Specifications
39
Bus Signal Timing
Table 9-11 shows the reset timing for the MPC860.
Figure 9-31 shows the reset timing for the data bus configuration.
Table 9-11. Reset Timing
Num
Characteristic
33 MHz
40 MHz
50 MHz
66 MHz
Unit
Min
Max
Min
Max
Min
Max
Min
Max
R69
CLKOUT to HRESET high
impedance
—
20.00
—
20.00
—
20.00
—
20.00
ns
R70
CLKOUT to SRESET high
impedance
—
20.00
—
20.00
—
20.00
—
20.00
ns
R71
RSTCONF pulse width
515.15
—
425.00
340.00
—
257.58
—
ns
R72
—
—
—
—
—
—
—
—
—
R73
Configuration data to HRESET rising
edge setup time
504.55
—
425.00
—
350.00
—
277.27
—
ns
R74
Configuration data to RSTCONF
rising edge setup time
350.00
—
350.00
—
350.00
—
350.00
—
ns
R75
Configuration data hold time after
RSTCONF negation
0.00
—
0.00
—
0.00
—
0.00
—
ns
R76
Configuration data hold time after
HRESET negation
0.00
—
0.00
—
0.00
—
0.00
—
ns
R77
HRESET and RSTCONF asserted to
data out drive
—
25.00
25.00
—
25.00
—
25.00
ns
R78
RSTCONF negated to data out high
impedance
—
25.00
—
25.00
—
25.00
—
25.00
ns
R79
CLKOUT of last rising edge before
chip three-state HRESET to data out
high impedance
—
25.00
—
25.00
—
25.00
—
25.00
ns
R80
DSDI, DSCK setup
90.91
—
75.00
—
60.00
—
45.45
—
ns
R81
DSDI, DSCK hold time
0.00
—
0.00
—
0.00
—
0.00
—
ns
R82
SRESET negated to CLKOUT rising
edge for DSDI and DSCK sample
242.42
—
200.00
—
160.00
—
121.21
—
ns
相關PDF資料
PDF描述
XPC860PZP50D4 Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:18; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:18-5
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