- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4042 > XPC8260ZUHFBC (Freescale Semiconductor)IC MPU POWERQUICC II 480-TBGA PDF資料下載
參數(shù)資料
| 型號： | XPC8260ZUHFBC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 3/41頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II 480-TBGA |
| 標準包裝： | 21 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 166MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 480-LBGA |
| 供應商設備封裝： | 408-TBGA（37.5x37.5） |
| 包裝： | 托盤 |
第1頁第2頁當前第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
11
Electrical and Thermal Characteristics
2.3.1
Layout Practices
Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground
pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The VCC power supply should be bypassed to ground using at least four
0.1 F by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads
and associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an
inch per capacitor lead. A four-layer board is recommended, employing two inner layers as V
CC and GND
planes.
All output pins on the MPC8260 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize overdamped conditions and reflections caused by these
fast output switching times. This recommendation particularly applies to the address and data buses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be
inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
Table 5 provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required for conditions above PD = 3W (when the ambient temperature is 70° C or
greater) to ensure the junction temperature does not exceed the maximum specified value. Also note that
the I/O power should be included when determining whether to use a heat sink.
Table 5. Estimated Power Dissipation for Various Configurations1
1 Test temperature = room temperature (25° C)
Bus
(MHz)
CPM
Multiplier
CPU
Multiplier
CPM
(MHz)
CPU
(MHz)
PINT (W)
2
2 P
INT = IDD x VDD Watts
Vddl
2.4
2.5
2.6
2.7
2.83
3 2.8 Vddl does not apply to HiP3 Rev C silicon.
33.3
4
133.3
2.04
2.14
2.26
2.38
2.50
50.0
2
3
100
150.0
2.21
2.30
2.45
2.59
2.69
66.7
2
2.5
133.3
166.7
2.47
2.62
2.74
2.88
3.02
66.7
2.5
166.7
2.57
2.69
2.83
2.98
3.12
66.7
2
3
133.3
200.0
2.81
2.95
3.12
3.29
3.43
66.7
2.5
3
166.7
200.0
2.88
3.05
3.22
3.38
3.55
50.0
3
4
150
200.0
2.83
3.00
3.14
3.31
3.48
Note:
相關PDF資料 |
PDF描述 |
|---|---|
| FMC31DREF-S734 | CONN EDGECARD 62POS .100 EYELET |
| IDT70V9079L9PF8 | IC SRAM 256KBIT 9NS 100TQFP |
| XPC8260VVHFBC | IC MPU POWERQUICC II 480-TBGA |
| MPC8264AZUPJDB | IC MPU POWERQUICC II 480-TBGA |
| FMM44DSEF | CONN EDGECARD 88POS .156 EYELET |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XPC8260ZUIFBC | 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| XPC8260ZUIGAB3 | 制造商:FREESCALE-SEMI 功能描述: |
| XPC8260ZUIHBC | 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| XPC8315E-RDB | 制造商:Freescale Semiconductor 功能描述: |
| XPC850CVR50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA（25x25） 包裝:托盤 |
發(fā)布緊急采購，3分鐘左右您將得到回復。