參數(shù)資料
型號: XC3S1400AN-4FG676I
廠商: Xilinx Inc
文件頁數(shù): 80/123頁
文件大小: 0K
描述: IC FPGA SPARTAN 3AN 676FBGA
標準包裝: 40
系列: Spartan®-3AN
LAB/CLB數(shù): 2816
邏輯元件/單元數(shù): 25344
RAM 位總計: 589824
輸入/輸出數(shù): 502
門數(shù): 1400000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-FBGA(27x27)
Spartan-3AN FPGA Family: Introduction and Ordering Information
DS557 (v4.1) April 1, 2011
Product Specification
6
Package Marking
Figure 3 provides a top marking example for Spartan-3AN
FPGAs in the quad-flat packages. Figure 4 shows the top
marking for Spartan-3AN FPGAs in BGA packages. The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator.
The “5C” and “4I” Speed Grade/Temperature Range part
combinations may be dual marked as “5C/4I”. Devices
with the dual mark can be used as either -5C or -4I devices.
Devices with a single mark are only guaranteed for the
marked speed grade and temperature range.
X-Ref Target - Figure 3
Figure 3: Spartan-3AN FPGA QFP Package Marking Example
X-Ref Target - Figure 4
Figure 4: Spartan-3AN FPGA BGA Package Marking Example
Date Code
Mask Revision Code
Process Technology
XC3S50AN
TM
TQG144 AGQ0725
4C
SPARTAN
Temperature Range
Fabrication Code
Pin P1
Device Type
Package
Speed Grade
R
DS557-1_02_080107
Lot Code
Date Code
XC3S200AN
TM
4C
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
DS557-1_03_080107
FTG256 AGQ0725
D1234567A
Mask Revision Code
Process Code
Fabrication Code
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S1400AN-4FGG484C 功能描述:IC FPGA SPARTAN-3AN 484FPGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3AN 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC3S1400AN-4FGG484I 功能描述:IC FPGA SPARTAN-3AN 484FPGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3AN 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC3S1400AN-4FGG676C 功能描述:IC SPARTAN-3AN FPGA 1400K 676FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3AN 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱:220-1241
XC3S1400AN-4FGG676CES 制造商:Xilinx 功能描述:
XC3S1400AN-4FGG676I 功能描述:IC FPGA SPARTAN-AN 1400K 676FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3AN 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)