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參數(shù)資料
| 型號： | XC17S10XLVOG8C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 2/11頁 |
| 文件大小： | 0K |
| 描述： | IC PROM SERIEAL 10K 8-SOIC |
| 產(chǎn)品變化通告： | Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 98 |
| 可編程類型： | OTP |
| 存儲容量： | 100kb |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-TSOP |
| 包裝： | 管件 |
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
10
R
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
Note: When marking the device number on the XL parts, an L is used in place of an XL.
Revision History
The following table shows the revision history for this document.
Date
Revision
07/14/98
1.1
09/08/98
1.2
Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD
notation in Absolute Maximum table since it is now included in Xilinx’s Reliability Monitor Report.
01/20/00
1.3
Added additional Spartan-XL parts, changed SPROM to PROM.
02/18/00
1.4
Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1.
04/04/00
1.5
Added XC17S200XL PROM for Spartan XC2S200.
08/06/00
1.6
Updated format.
04/07/01
1.7
Added to features: “Guaranteed 20 year life data retention.”
10/10/01
1.8
11/04/02
1.9
Updated Table 1, page 2. Updated the template. Added "Pinout Diagrams," page 2.
11/18/02
1.10
Modified document title.
17S20L
V
C
Operating Range/Processing
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
Package Mark
O = 8-pin Plastic Small-Outline Package, Lead-Free
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Lead-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Lead-Free
S = 20-pin Plastic Small-Outline Package
Device Number
17S05
17S05L
17S10
17S10L
17S20
17S20L
17S30
17S30L
17S40
17S40L
17S50L
17S100L
17S150L
Product Obsolete or Under Obsolescence
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| XC17S10XLVOG8I | 功能描述:IC PROM SERIEAL 10K 8-SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17S150APD8C | 功能描述:IC PROM SER 150000 C-TEMP 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17S150APD8C0280 | 制造商:Xilinx 功能描述: |
| XC17S150APD8I | 功能描述:IC PROM SER 150000 I-TEMP 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17S150ASO20C | 功能描述:IC PROM SER 150000 C-TEMP 20SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
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