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參數(shù)資料
| 型號(hào)： | XC17256EPDG8C |
| 廠商： | Xilinx Inc |
| 文件頁(yè)數(shù)： | 2/15頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 產(chǎn)品變化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 可編程類(lèi)型： | OTP |
| 存儲(chǔ)容量： | 256Kb |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應(yīng)商設(shè)備封裝： | 8-PDIP |
| 包裝： | 管件 |
| 其它名稱(chēng)： | 122-1576-5 |
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10
Device Package User Guide
UG112 (v3.7) September 5, 2012
Chapter 1: Package Information
R
Package Drawings
Package drawings are mechanical specifications that include exact dimensions for the
placement of pins, height of the package, and related information.
Package drawings are available online at
Material Data Declaration Sheet (MDDS)
The MDDS template used by Xilinx is based on the Electronic Industries Alliance (EIA)
September 19, Material Composition Declaration Guide dated September 19, 2003 for
Level A and Level B materials of interest.
As per EIA, “Level A” List is composed of materials and substances subject to currently
enacted legislation that:
a.
Prohibits their use and/or marketing
b. Restricts their use and/or marketing
c.
Requires reporting or results in other regulatory effect.
As per EIA, “Level B” List is composed of materials and substances that the industry has
determined relevant for disclosure because they meet one or more of the following criteria:
a.
Precious materials/substances that provide economic value for end-of-life
management purposes
b. Materials/substances that are of significant environmental, health, or safety
interest
c.
Materials/substances that would trigger hazardous waste management
requirements
d. Materials/substances that could have a negative impact on end-of-life
management.
See the EIA standard for more specific information.
MDDS documents are available online at
Information about Pb-Free and RoHS-compliant products is available at
Package Samples
Xilinx offers two types of non-product-specific package samples that can help develop
custom processes and perform board-level tests. These samples can be ordered with
ordering codes as detailed below.
Mechanical Samples XCMECH-XXXXX (where XXXXX is the package code of interest)
This part type is used for mechanical evaluations, process setup, etc. Most packages are
based on the JEDEC outline, and these parts are at times referred to as "dummy" parts since
mechanical samples do not contain a die.
Example:
To order a FG676 package as a mechanical sample (without the die), the part number
would be XCMECH-FG676.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類(lèi)型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件 |
| XC17256L-PC20C | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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