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參數(shù)資料
| 型號： | WS512K32NBV-20H2CE |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 332K |
| 代理商： | WS512K32NBV-20H2CE |
WS512K32BV-XXXE
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
December, 1999
Rev. 2
NOT
RECOMENDED
FOR
NEW
DESIGNS
ORDERING INFORMATION
W S 512K 32 X B V - XXX X X E X
LEAD FINISH:
Blank
=
Gold plated leads
A
=
Solder dip leads
E = Epitaxial Layer
DEVICE GRADE:
I
=
Industrial
-40°C to +85°C
C
=
Commercial
0°C to +70°C
PACKAGE TYPE:
H2
=
Ceramic Hex-In-line Package, HIP (Package 402)
G2
=
22 mm Ceramic Quad Flat Pack, CQFP (Package 500)
ACCESS TIME (ns)
Low Voltage Supply 3.3V ± 10%
BiCMOS
IMPROVEMENT MARK:
N
=
No Connect at pin 21 and 39 in HIP for Upgrades
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
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PDF描述 |
|---|---|
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| WS512K32F-25G2TM | 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQMA68 |
| WS512K32F-35G4TCA | 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CQMA68 |
| WF512K32F-60G4C5A | 512K X 32 FLASH 5V PROM MODULE, 60 ns, CQFP68 |
| W7NCF02GH30CS2BG | 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NBV-20H2CEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2IE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2IEA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2ME | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2MEA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
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