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參數(shù)資料
| 型號： | WS512K32NBV-20H2CE |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封裝： | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大小： | 332K |
| 代理商： | WS512K32NBV-20H2CE |
WS512K32BV-XXXE
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
December, 1999
Rev. 2
PACKAGE 500: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2)
0.38 (0.015) ± 0.05 (0.002)
0.25 (0.010) ± 0.1 (0.002)
25.1 (0.990) ± 0.25 (0.010) SQ
1.27 (0.050) TYP
24.0 (0.946)
± 0.25 (0.010)
22.4 (0.880) ± 0.25 (0.010) SQ
20.3 (0.800) REF
5.1 (0.200) MAX
0.25 (0.010)
± 0.127 (0.005)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1 / 7
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
The WEDC 68 lead G2 CQFP fills the same fit and
function as the JEDEC 68 lead CQFJ or 68 PLCC. But
the G2 has the TCE and lead inspection advantage of
the CQFP form.
0.940”
TYP
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NBV-20H2CEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2IE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2IEA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2ME | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
| WS512K32NBV-20H2MEA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 3.3V SRAM MODULE |
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