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參數(shù)資料
| 型號： | WI125 EVAL KIT |
| 廠商： | Connor-Winfield |
| 文件頁數(shù)： | 17/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | GPS TIMING RECEIVER EVAL BOARD |
| 產(chǎn)品培訓模塊： | 125 Series GPS Based Timing and Synchronization Products |
| 標準包裝： | 1 |
| 主要目的： | 計時，時鐘發(fā)生器，同步器，GPS |
| 嵌入式： | 否 |
| 已用 IC / 零件： | WI125 |
| 主要屬性： | 1PPS/ 10 MHz 相位校準功能 |
| 次要屬性： | LED 狀態(tài)指示器 |
| 已供物品： | 模塊，板，天線，線纜，電源 |
| 其它名稱： | CW681 W125 EVAL KIT |
Wi125 Data Sheet #:
SG170
Page 8 of 20
Rev:
04
Date:
11/29/11
Copyright 2011 The Connor-Winfield Corp. All Rights Reserved
Specifications subject to change without notice
3.2 Wi125 Dimensions
ThefigurebelowprovidesthedimensionsofthepositioningoftheWi125castellations.Dimensionsareinmm
(inches/1000).
Figure 3 Wi125 Dimensions
3.3 Solder Pad Size and Placement
Itisrecommendedthatthefootprintofthesolderpadundereachcastellationbe2mmx1mm,centeredonthe
nominalcentrepointoftheradiusofthecastellation.Thecastellationsaregoldplatedandsoareleadfree.Note
thatiftheRF_INconnectorisbeingused,thereshouldnotbeapadorsolderresistundertheRF_INcastella-
tion.IftheRF_INcastellationistobeused,thepadshouldbeshortenedby0.5mmunderneaththeWi125and
standardRFdesignpracticesmustbeobserved.Thediagrambelowshowstheplacementofthepadsunderthe
castellations.
RF_IN
PIN 22
Figure 4 Solder Pad Size and Placement
3 PHYSICAL CHARACTERISTICS continued
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