參數(shù)資料
型號: WF1M32B-150H1M3A
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 11/13頁
文件大?。?/td> 600K
代理商: WF1M32B-150H1M3A
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
e
s
er
d
A
CS#
E#
O
E#
W
at
a
D
V
0.
5
A
P
A
P
H
5
t
C
W
t
S
C
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
W
t
H
D
t
S
D
Data#
Polling
t
S
A
t
C
R
t
P
W
H
0
A
0
A
t
E
O
t
F
D
t
H
O
t
E
C
t
L
W
H
G
t
1
H
W
H
W
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