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參數(shù)資料
| 型號(hào)： | WS128K32-85G1UQ |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 85 ns, CQMA68 |
| 封裝： | CERAMIC, LQFP-68 |
| 文件頁(yè)數(shù)： | 1/10頁(yè) |
| 文件大小： | 395K |
| 代理商： | WS128K32-85G1UQ |
4
SRAM
MODULES
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187
n Commercial, Industrial and Military Temperature
Ranges
n 5 Volt Power Supply
n Low Power CMOS
n TTL Compatible Inputs and Outputs
n Built in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
n Weight
WS128K32-XG1U - 5 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
n All devices are upgradeable to 512Kx32
FEATURES
n Access Times of 70, 85, 100, 120ns
n MIL-STD-883 Compliant Devices Available
n Packaging
66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch)
high, (Package 510)
68 lead, Hermetic CQFP (G1U), 23.9mm
(0.940 inch) square, 4.57mm (0.140inch) high,
(Package 519)
n Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCKDIAGRAM
TOP VIEW
FIG. 1 PIN CONFIGURATION FOR WS128K32N-XH1X
September2001Rev.3
I/O8
I/O9
I/O10
A14
A16
A11
A0
NC
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A9
A15
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
NC
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A4
A5
A6
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
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