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參數(shù)資料
| 型號： | WEDPF2M64B-120BC3 |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 2M X 64 FLASH 3.3V PROM MODULE, 120 ns, PBGA119 |
| 封裝： | STACKED TSOP, BGA-119 |
| 文件頁數(shù)： | 5/13頁 |
| 文件大小： | 317K |
| 代理商： | WEDPF2M64B-120BC3 |
13
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPF2M64-XBX3
1 2
3
4 5
6 7
8
9 10 11 12 13 14 15
H
G
F
E
D
C
B
A
1.27/2
8.89 (0.35)
typ
24.00 (0.944) MAX
17.78 (0.700) typ
14.00
(0.551)
MAX
7.56 (0.298)
MAX
0.76 (0.030)
typ
119 x 0.76
1.27/2
WED P F 2M64
B - XXX X B 3
ORDERING INFORMATION
PROGRAMMING VOLTAGE
3 = 3.3V
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
B = 119 Stacked TSOP BGA
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 2M x 64
User configurable as 4M x 32, 8M x 16 or 16M x 8
Flash
Plastic
WHITE ELECTRONIC DESIGNS CORP.
PACKAGE: 119 STACKED TSOP BGA
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
TOP VIEW
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